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Buffer/Inverter Based Peripheral Driver, 1 Driver, 16A, ROHS COMPLIANT, TO-220, 5PIN
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
AUIPS6031 by Infineon Technologies AG is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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Cytech Systems Limited | IC PWR SWITCH N-CHAN 1:1 TO220 | 5000 |
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RFQ | |
DISTI #
SP001515366
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EBV Elektronik | Power Switch Hi Side 89A 5Pin5Tab TO220 Tube (Alt: SP001515366) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 143 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
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AUIPS6031
Infineon Technologies AG
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Datasheet
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Compare Parts:
AUIPS6031
Infineon Technologies AG
Buffer/Inverter Based Peripheral Driver, 1 Driver, 16A, ROHS COMPLIANT, TO-220, 5PIN
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | ROHS COMPLIANT, TO-220, 5PIN | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Infineon | |
Built-in Protections | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE | |
Driver Number of Bits | 1 | |
Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
JESD-30 Code | R-XSFM-T5 | |
Number of Functions | 1 | |
Number of Terminals | 5 | |
Output Current Flow Direction | SINK | |
Output Current-Max | 8.9 A | |
Output Peak Current Limit-Nom | 16 A | |
Package Body Material | UNSPECIFIED | |
Package Code | SFM | |
Package Equivalence Code | SIP5,.1,67TB | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Peak Reflow Temperature (Cel) | 250 | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Supply Voltage-Max | 28 V | |
Supply Voltage-Min | 6 V | |
Supply Voltage-Nom | 14 V | |
Surface Mount | NO | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 1.7 mm | |
Terminal Position | SINGLE | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Turn-off Time | 45 µs | |
Turn-on Time | 25 µs |
Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current capability according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
Infineon recommends using a ceramic capacitor with a value of 10 μF to 22 μF and a voltage rating of 25 V or higher. The capacitor should be placed as close as possible to the VIN pin to minimize parasitic inductance.
To troubleshoot OCP issues, check the device's OCP threshold setting, ensure that the sense resistor is properly connected, and verify that the device is not overheating. Also, check for any electrical noise or transients that may be triggering the OCP.
Infineon recommends using wide, low-impedance traces for the high-current paths (VIN, VOUT, and GND) to minimize voltage drops and electromagnetic interference (EMI). Use a symmetrical layout and avoid sharp corners or bends in the traces.