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Part Details for ATP302-TL-H by onsemi
Results Overview of ATP302-TL-H by onsemi
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Healthcare
ATP302-TL-H Information
ATP302-TL-H by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for ATP302-TL-H
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
13AC6082
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Newark | Mosfet, P-Ch, -60V, -70A, Atpak, Channel Type:P Channel, Drain Source Voltage Vds:60V, Continuous Drain Current Id:70A, Transistor Mounting:Surface Mount, Rds(On) Test Voltage:10V, Gate Source Threshold Voltage Max:2.6V, Msl:- Rohs Compliant: Yes |Onsemi ATP302-TL-H RoHS: Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Cut Tape | 0 |
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Buy Now | |
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DISTI #
52T7542
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Newark | Pch 4.5V Drive Series/Reel |Onsemi ATP302-TL-H RoHS: Not Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Buy Now | |
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DISTI #
ATP302-TL-H
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Avnet Americas | Trans MOSFET P-CH 60V 70A 3-Pin(2+Tab) ATPAK T/R - Tape and Reel (Alt: ATP302-TL-H) RoHS: Compliant Min Qty: 228 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 1564 Partner Stock |
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$2.7060 / $2.9700 | Buy Now |
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DISTI #
ATP302-TL-H
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Avnet Silica | Trans MOSFET PCH 60V 70A 3Pin2Tab ATPAK TR (Alt: ATP302-TL-H) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
ATP302-TL-H
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EBV Elektronik | Trans MOSFET PCH 60V 70A 3Pin2Tab ATPAK TR (Alt: ATP302-TL-H) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 1564 |
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RFQ | |
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Vyrian | Transistors | 3223 |
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RFQ | |
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Win Source Electronics | MOSFET P-CH 60V 70A ATPAK | 18000 |
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$4.2901 / $6.4350 | Buy Now |
Part Details for ATP302-TL-H
ATP302-TL-H CAD Models
ATP302-TL-H Part Data Attributes
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ATP302-TL-H
onsemi
Buy Now
Datasheet
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Compare Parts:
ATP302-TL-H
onsemi
P-Channel Power MOSFET, -60V, -70A, 13mΩ, DPAK (Single Gauge) / ATPAK, 3000-REEL
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Package Description | HALOGEN AND LEAD FREE, ATPAK-3/2 | |
| Pin Count | 3 | |
| Manufacturer Package Code | 369AM | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | onsemi | |
| Avalanche Energy Rating (Eas) | 197 mJ | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 60 V | |
| Drain Current-Max (ID) | 70 A | |
| Drain-source On Resistance-Max | 0.018 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PSSO-G2 | |
| JESD-609 Code | e6 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | P-CHANNEL | |
| Power Dissipation-Max (Abs) | 70 W | |
| Pulsed Drain Current-Max (IDM) | 280 A | |
| Surface Mount | YES | |
| Terminal Finish | TIN BISMUTH | |
| Terminal Form | GULL WING | |
| Terminal Position | SINGLE | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Element Material | SILICON |
ATP302-TL-H Frequently Asked Questions (FAQ)
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A good PCB layout for the ATP302-TL-H should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure a low-thermal-resistance path to the heat sink. Use a 2-3 layer PCB with a solid ground plane to reduce thermal resistance. Avoid placing thermal vias under the device, and use a thermal relief pattern around the device to minimize thermal resistance.
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To ensure reliable operation in high-temperature environments, follow the recommended operating conditions and derating guidelines in the datasheet. Implement a robust thermal management system, such as a heat sink or fan, to maintain a safe junction temperature (Tj). Monitor the device's temperature and adjust the system design accordingly.
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The ATP302-TL-H has built-in ESD protection, but it's still essential to follow proper handling and storage precautions to prevent damage. Handle the device by the body or pins, avoiding direct contact with the die. Use an anti-static wrist strap or mat, and store the device in an anti-static bag or container.
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Yes, the ATP302-TL-H is suitable for high-reliability and automotive applications. It meets the AEC-Q100 qualification standard for automotive-grade devices. However, ensure you follow the recommended operating conditions, and consult with onsemi's application engineers for specific guidance on using the device in your application.
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Follow the recommended soldering temperature profile and assembly guidelines in the datasheet. Use a soldering iron with a temperature range of 350°C to 370°C, and avoid applying excessive force or bending the leads during assembly. Ensure the device is properly aligned and seated during PCB assembly.