Part Details for AT91SAM9CN12B-CUR by Atmel Corporation
Results Overview of AT91SAM9CN12B-CUR by Atmel Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
AT91SAM9CN12B-CUR Information
AT91SAM9CN12B-CUR by Atmel Corporation is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| GC321AD7LP153KX18D | Murata Manufacturing Co Ltd | High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive | |
| GC331BD7LP473KX18L | Murata Manufacturing Co Ltd | High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive | |
| GC332DD7LP154KX18L | Murata Manufacturing Co Ltd | High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive |
Part Details for AT91SAM9CN12B-CUR
AT91SAM9CN12B-CUR CAD Models
AT91SAM9CN12B-CUR Part Data Attributes
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AT91SAM9CN12B-CUR
Atmel Corporation
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Datasheet
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AT91SAM9CN12B-CUR
Atmel Corporation
RISC Microprocessor, 400MHz, CMOS, PBGA217, 0.80 MM PITCH, GREEN, MO-205, BGA-217
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Package Description | LFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 26 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B217 | |
| JESD-609 Code | e8 | |
| Length | 15 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 217 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.4 mm | |
| Speed | 400 MHz | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 0.9 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |