Part Details for AS6C1608-55BINTR by Alliance Memory Inc
Results Overview of AS6C1608-55BINTR by Alliance Memory Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
AS6C1608-55BINTR Information
AS6C1608-55BINTR by Alliance Memory Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for AS6C1608-55BINTR
AS6C1608-55BINTR CAD Models
AS6C1608-55BINTR Part Data Attributes
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AS6C1608-55BINTR
Alliance Memory Inc
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Datasheet
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AS6C1608-55BINTR
Alliance Memory Inc
Standard SRAM, 2MX8, 55ns, CMOS, PBGA48, 8 X 10 MM, GREEN, MO-207, TFBGA-48
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Part Package Code | DSBGA | |
| Package Description | LFBGA, | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-PBGA-B48 | |
| Length | 10 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |
AS6C1608-55BINTR Frequently Asked Questions (FAQ)
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The AS6C1608-55BINTR can operate from -40°C to 85°C, making it suitable for industrial and commercial applications.
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Yes, the AS6C1608-55BINTR is lead-free and compliant with the European Union's Restriction of Hazardous Substances (RoHS) directive.
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The typical standby current consumption of the AS6C1608-55BINTR is around 10mA, making it suitable for battery-powered applications.
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Yes, the AS6C1608-55BINTR is designed to operate from a single 3.0V to 3.6V power supply, making it suitable for 3.3V systems.
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The minimum clock cycle time for the AS6C1608-55BINTR is 10ns, allowing for fast data access and transfer.