Part Details for AS4C64M32MD4-062BAN by Alliance Memory Inc
Results Overview of AS4C64M32MD4-062BAN by Alliance Memory Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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AS4C64M32MD4-062BAN Information
AS4C64M32MD4-062BAN by Alliance Memory Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for AS4C64M32MD4-062BAN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK7115
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Newark | Lpddr4, 2G, 64M X 32, 1.1V, 200 Ball Tfbga, 1600Mhz, Ecc, Auto Temp |Alliance Memory AS4C64M32MD4-062BAN RoHS: Not Compliant Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$19.3300 / $20.0100 | Buy Now |
DISTI #
1450-AS4C64M32MD4-062BAN-ND
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DigiKey | IC DRAM 2GBIT LVSTL 200FBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
680 In Stock |
|
$14.1250 / $17.2200 | Buy Now |
DISTI #
AS4C64M32MD4-062BA
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Avnet Americas | DRAM Chip LPDDR4 SDRAM 2Gbits 64M X 32 2.1V 200-Pin FBGA Tray - Trays (Alt: AS4C64M32MD4-062BA) RoHS: Not Compliant Min Qty: 680 Package Multiple: 136 Lead time: 16 Weeks, 0 Days Container: Tray | 514 Factory Stock |
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$13.5600 / $13.8990 | Buy Now |
DISTI #
913-4C64M32MD4062BAN
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Mouser Electronics | DRAM LPDDR4, 2G, 64M x 32, 1.1V, 200 BALL TFBGA, 1600MHZ, ECC, Automotive Temp - Tray RoHS: Compliant | 0 |
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$14.1200 / $14.1300 | Order Now |
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Karl Kruse GmbH & Co KG | LPDDR4 2G 64M x 32 1.1V 200 BALL TFBGA 1600MHZ ECC AUTO TEMP | 378 |
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RFQ |
Part Details for AS4C64M32MD4-062BAN
AS4C64M32MD4-062BAN CAD Models
AS4C64M32MD4-062BAN Part Data Attributes
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AS4C64M32MD4-062BAN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C64M32MD4-062BAN
Alliance Memory Inc
LPDDR4 DRAM, 64MX32, CMOS, PBGA200, FBGA-200
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Package Description | FBGA-200 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | Alliance Memory | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX | |
Clock Frequency-Max (fCLK) | 1600 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 16,32 | |
JESD-30 Code | R-PBGA-B200 | |
Length | 14.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | LPDDR4 DRAM | |
Memory Width | 32 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 200 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA200,12X22,32/25 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Seated Height-Max | 0.8 mm | |
Self Refresh | YES | |
Sequential Burst Length | 16,32 | |
Supply Voltage-Max (Vsup) | 1.17 V | |
Supply Voltage-Min (Vsup) | 1.06 V | |
Supply Voltage-Nom (Vsup) | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 10 mm |