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Part Details for AS4C256M16D3C-12BIN by Alliance Memory Inc
Results Overview of AS4C256M16D3C-12BIN by Alliance Memory Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
AS4C256M16D3C-12BIN Information
AS4C256M16D3C-12BIN by Alliance Memory Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for AS4C256M16D3C-12BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
82AK3794
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Newark | Dram, 800Mhz, 4Gbit, Fbga-96, Dram Type:Ddr3, Memory Configuration:256M X 16Bit, Clock Frequency Max:800Mhz, Ic Case/Package:Fbga, No. Of Pins:96Pins, Supply Voltage Nom:1.5V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Alliance Memory AS4C256M16D3C-12BIN RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 209 |
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$6.9500 | Buy Now |
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DISTI #
1450-AS4C256M16D3C-12BIN-ND
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DigiKey | IC DRAM 4GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
9316 In Stock |
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$8.7591 / $11.1500 | Buy Now |
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DISTI #
AS4C256M16D3C-12BIN
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Avnet Americas | DRAM, DDR3, 4 Gbit, 256M x 16bit, 800 MHz, 96-Pin, FBGA - Trays (Alt: AS4C256M16D3C-12BIN) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 6 Weeks, 0 Days Container: Tray | 6595 Factory Stock |
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$6.6720 / $7.2570 | Buy Now |
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DISTI #
913-4C256M16D312BIN
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Mouser Electronics | DRAM DDR3, 4G, 256M x 16, 1.5V, 96-ball FBGA, 800MHz, Industrial Temp - Tray RoHS: Compliant | 769 |
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$7.3700 / $8.4600 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR3 4G 256M x 16 1.5V 96-ball FBGA 800MHz Industrial Temp | 25066 |
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RFQ | |
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DISTI #
AS4C256M16D3C-12BIN
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Avnet Silica | DRAM DDR3 4 Gbit 256M x 16bit 800 MHz 96Pin FBGA (Alt: AS4C256M16D3C-12BIN) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 7 Weeks, 0 Days | Silica - 418 |
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Buy Now | |
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LCSC | FBGA-96(7.5x13.5) DDR SDRAM ROHS | 50 |
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$10.5533 / $12.9672 | Buy Now |
Part Details for AS4C256M16D3C-12BIN
AS4C256M16D3C-12BIN CAD Models
AS4C256M16D3C-12BIN Part Data Attributes
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AS4C256M16D3C-12BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C256M16D3C-12BIN
Alliance Memory Inc
DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 6 Weeks | |
| Date Of Intro | 2020-03-26 | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 13.5 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.008 A | |
| Standby Voltage-Min | 1.425 V | |
| Supply Current-Max | 0.19 mA | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.5 mm |
AS4C256M16D3C-12BIN Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the AS4C256M16D3C-12BIN is 0°C to 85°C.
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The AS4C256M16D3C-12BIN requires a refresh cycle every 64ms, with a minimum of 4096 refreshes within an 64ms interval.
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The AS4C256M16D3C-12BIN supports a maximum clock frequency of 133MHz.
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After power-up, the SDRAM must be initialized by sending a series of commands, including a PRECHARGE ALL command, an AUTOREFRESH command, and a MODE REGISTER SET command.
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The AS4C256M16D3C-12BIN has a latency of 3 clock cycles (CL3).