Part Details for APTMC120TAM12CTPAG by Microchip Technology Inc
Results Overview of APTMC120TAM12CTPAG by Microchip Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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APTMC120TAM12CTPAG Information
APTMC120TAM12CTPAG by Microchip Technology Inc is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for APTMC120TAM12CTPAG
Part # | Distributor | Description | Stock | Price | Buy | |
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NAC | CC6541 RoHS: Compliant Min Qty: 100 Package Multiple: 1 Container: Tube | 0 |
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RFQ | |
DISTI #
APTMC120TAM12CT
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Richardson RFPD | SILICON CARBIDE MOSFET MODULES RoHS: Compliant Min Qty: 1 | 0 |
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RFQ | |
DISTI #
APTMC120TAM12CTPAG
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Avnet Silica | Trans MOSFET Array Dual NCH 1200V 220A 23Pin Case SP6P (Alt: APTMC120TAM12CTPAG) RoHS: Compliant Min Qty: 100 Package Multiple: 1 | Silica - 0 |
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Buy Now | |
DISTI #
APTMC120TAM12CTPAG
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EBV Elektronik | Trans MOSFET Array Dual NCH 1200V 220A 23Pin Case SP6P (Alt: APTMC120TAM12CTPAG) RoHS: Compliant Min Qty: 100 Package Multiple: 1 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for APTMC120TAM12CTPAG
APTMC120TAM12CTPAG CAD Models
APTMC120TAM12CTPAG Part Data Attributes
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APTMC120TAM12CTPAG
Microchip Technology Inc
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Datasheet
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APTMC120TAM12CTPAG
Microchip Technology Inc
Power Field-Effect Transistor, 220A I(D), 1200V, 0.012ohm, 6-Element, N-Channel, Silicon Carbide, Metal-oxide Semiconductor FET
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | MODULE-26 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Factory Lead Time | 77 Weeks | |
Case Connection | ISOLATED | |
Configuration | 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | |
DS Breakdown Voltage-Min | 1200 V | |
Drain Current-Max (ID) | 220 A | |
Drain-source On Resistance-Max | 0.012 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JESD-30 Code | R-XUFM-X26 | |
Number of Elements | 6 | |
Number of Terminals | 26 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | N-CHANNEL | |
Power Dissipation-Max (Abs) | 925 W | |
Pulsed Drain Current-Max (IDM) | 440 A | |
Surface Mount | NO | |
Terminal Form | UNSPECIFIED | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON CARBIDE |
APTMC120TAM12CTPAG Frequently Asked Questions (FAQ)
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Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device within its specified temperature range.
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The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 3.0V to 5.0V.
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The APTMC120TAM12CTPAG has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, grounding straps, and follow proper handling techniques to prevent damage to the device.
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The recommended power-up sequence is to apply the power supply voltage (VCC) before applying any input signals. This ensures that the internal biasing and voltage regulators are properly initialized before the device starts operating.