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Part Details for APT17NTR-G1 by Diodes Incorporated
Results Overview of APT17NTR-G1 by Diodes Incorporated
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
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Renewable Energy
Automotive
APT17NTR-G1 Information
APT17NTR-G1 by Diodes Incorporated is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for APT17NTR-G1
APT17NTR-G1 CAD Models
APT17NTR-G1 Part Data Attributes
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APT17NTR-G1
Diodes Incorporated
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Datasheet
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APT17NTR-G1
Diodes Incorporated
Small Signal Bipolar Transistor, 0.05A I(C), NPN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | DIODES INC | |
| Package Description | SOT-23, 3 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.21.00.95 | |
| Samacsys Manufacturer | Diodes Incorporated | |
| Collector Current-Max (IC) | 0.05 A | |
| Collector-Emitter Voltage-Max | 480 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 20 | |
| JESD-30 Code | R-PDSO-G3 | |
| JESD-609 Code | e3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | NPN | |
| Power Dissipation Ambient-Max | 0.2 W | |
| Power Dissipation-Max (Abs) | 0.2 W | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
APT17NTR-G1 Frequently Asked Questions (FAQ)
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For optimal thermal performance, it is recommended to use a multi-layer PCB with a thermal relief pattern under the device, and to connect the thermal pad to a large copper area on the PCB to dissipate heat efficiently.
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To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, ensure proper thermal management, and consider derating the device's power handling capabilities at elevated temperatures.
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The APT17NTR-G1 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and installation to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
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While the APT17NTR-G1 is suitable for high-frequency switching applications, it is essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the device is properly driven to prevent oscillations and ensure reliable operation.
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When paralleling multiple APT17NTR-G1 devices, it is crucial to ensure that each device has its own current sense resistor and that the devices are properly synchronized to prevent current imbalance and ensure reliable operation.