Part Details for AP65502SP-13 by Diodes Incorporated
Results Overview of AP65502SP-13 by Diodes Incorporated
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AP65502SP-13 Information
AP65502SP-13 by Diodes Incorporated is a Switching Regulator or Controller.
Switching Regulator or Controllers are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Part Details for AP65502SP-13
AP65502SP-13 CAD Models
AP65502SP-13 Part Data Attributes
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AP65502SP-13
Diodes Incorporated
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Datasheet
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AP65502SP-13
Diodes Incorporated
Switching Regulator, Current-mode, 500kHz Switching Freq-Max, PDSO8, GREEN, SOP-8
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | DIODES INC | |
Package Description | GREEN, SOP-8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Diodes Incorporated | |
Additional Feature | OUTPUT VOLTAGE RANGE FROM 0.8 V TO 12 V | |
Analog IC - Other Type | SWITCHING REGULATOR | |
Control Mode | CURRENT-MODE | |
Control Technique | PULSE WIDTH MODULATION | |
Input Voltage-Max | 17 V | |
Input Voltage-Min | 4.75 V | |
Input Voltage-Nom | 12 V | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HLSOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.5 mm | |
Surface Mount | YES | |
Switcher Configuration | BUCK | |
Switching Frequency-Max | 500 kHz | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.9 mm |
AP65502SP-13 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
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To ensure proper power-up and configuration, follow the recommended power-up sequence, and make sure to tie the EN pin high to enable the device. Also, configure the FB pin according to the desired output voltage.
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When selecting the output capacitor, consider the output voltage ripple, equivalent series resistance (ESR), and capacitance value. A low-ESR capacitor with a capacitance value between 10uF to 22uF is recommended.
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The AP65502SP-13 has built-in overcurrent protection. To handle faults, monitor the OCP pin, which goes low when an overcurrent condition is detected. You can also use the EN pin to shut down the device in case of a fault.
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Thermal design considerations include providing adequate airflow, using a heat sink if necessary, and ensuring the device is mounted on a multi-layer PCB with a solid ground plane to dissipate heat efficiently.