Part Details for AM27C010-70DC by Spansion
Results Overview of AM27C010-70DC by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Aerospace and Defense
AM27C010-70DC Information
AM27C010-70DC by Spansion is an EPROM.
EPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for AM27C010-70DC
AM27C010-70DC CAD Models
AM27C010-70DC Part Data Attributes
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AM27C010-70DC
Spansion
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Datasheet
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AM27C010-70DC
Spansion
UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-CDIP-T32 | |
| Length | 42.1 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C010-70DC
This table gives cross-reference parts and alternative options found for AM27C010-70DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C010-70DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 5962-8961408MXX | AMD | Check for Price | UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 | AM27C010-70DC vs 5962-8961408MXX |
| FT27C010-70DC | Force Technologies Ltd | Check for Price | UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIL-32 | AM27C010-70DC vs FT27C010-70DC |
| 5962-8961408MXA | QP Semiconductor | Check for Price | UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 | AM27C010-70DC vs 5962-8961408MXA |
| 27CX010WI-70 | Integrated Circuit Technology Corp | Check for Price | UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | AM27C010-70DC vs 27CX010WI-70 |
| 5962-8961408MXX | QP Semiconductor | Check for Price | UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 | AM27C010-70DC vs 5962-8961408MXX |
| CY27C010-70WC | Cypress Semiconductor | Check for Price | UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | AM27C010-70DC vs CY27C010-70WC |
| 59628961413QXX | Cypress Semiconductor | Check for Price | 128KX8 UVPROM, 70ns, CDIP32, CERAMIC, DIP-32 | AM27C010-70DC vs 59628961413QXX |