Part Details for AGLN250V2-VQ100I by Microsemi Corporation
Results Overview of AGLN250V2-VQ100I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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AGLN250V2-VQ100I Information
AGLN250V2-VQ100I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for AGLN250V2-VQ100I
AGLN250V2-VQ100I CAD Models
AGLN250V2-VQ100I Part Data Attributes
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AGLN250V2-VQ100I
Microsemi Corporation
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Datasheet
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AGLN250V2-VQ100I
Microsemi Corporation
Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 6144 | |
| Number of Equivalent Gates | 250000 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 6144 CLBS, 250000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |
Alternate Parts for AGLN250V2-VQ100I
This table gives cross-reference parts and alternative options found for AGLN250V2-VQ100I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AGLN250V2-VQ100I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| AGLN250V2-VQ100 | Microchip Technology Inc | $27.4864 | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100 | AGLN250V2-VQ100I vs AGLN250V2-VQ100 |
| AGLN250V2-VQ100I | Actel Corporation | Check for Price | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, 250MHz, 6144-Cell, CMOS, PQFP100, 14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, VQFP-100 | AGLN250V2-VQ100I vs AGLN250V2-VQ100I |
| AGLN250V2-VQG100 | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100 | AGLN250V2-VQ100I vs AGLN250V2-VQG100 |
| AGLN250V2-VQG100I | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100 | AGLN250V2-VQ100I vs AGLN250V2-VQG100I |
| AGLN250V2-VQ100 | Actel Corporation | Check for Price | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, 250MHz, 6144-Cell, CMOS, PQFP100, 14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, VQFP-100 | AGLN250V2-VQ100I vs AGLN250V2-VQ100 |
AGLN250V2-VQ100I Frequently Asked Questions (FAQ)
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The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near a thermal pad or heat sink to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer.
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To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature. Additionally, consider using thermal management techniques, such as heat sinks or fans, to maintain a stable temperature.
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The AGLN250V2-VQ100I is designed to meet the radiation hardness requirements for space and aerospace applications. The device is tested to withstand total ionizing dose (TID) effects up to 100 krad(Si) and single-event effects (SEEs) up to 37 MeV-cm²/mg.
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Yes, the AGLN250V2-VQ100I is designed for high-reliability and safety-critical applications. It meets the requirements for NASA's EEE-INST-002 and EEE-INST-003, and is also compliant with the European Space Agency's (ESA) ECSS-Q-60A standard.
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To prevent electrostatic discharge (ESD) damage, handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper handling and storage procedures. The device is designed to withstand ESD up to 2 kV per the Human Body Model (HBM) and 250 V per the Machine Model (MM).