Datasheets
AGLN250V2-VQ100 by:

Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

Part Details for AGLN250V2-VQ100 by Microsemi Corporation

Results Overview of AGLN250V2-VQ100 by Microsemi Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

AGLN250V2-VQ100 Information

AGLN250V2-VQ100 by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Part Details for AGLN250V2-VQ100

AGLN250V2-VQ100 CAD Models

AGLN250V2-VQ100 Part Data Attributes

AGLN250V2-VQ100 Microsemi Corporation
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AGLN250V2-VQ100 Microsemi Corporation Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
JESD-30 Code S-PQFP-G100
JESD-609 Code e0
Length 14 mm
Moisture Sensitivity Level 3
Number of CLBs 6144
Number of Equivalent Gates 250000
Number of Terminals 100
Operating Temperature-Max 70 °C
Operating Temperature-Min -20 °C
Organization 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 14 mm

Alternate Parts for AGLN250V2-VQ100

This table gives cross-reference parts and alternative options found for AGLN250V2-VQ100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AGLN250V2-VQ100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
AGLN250V2-VQ100 Microchip Technology Inc $27.4864 Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100 AGLN250V2-VQ100 vs AGLN250V2-VQ100
Part Number Manufacturer Composite Price Description Compare
AGLN250V2-VQ100I Microchip Technology Inc $31.4602 Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PQFP100 AGLN250V2-VQ100 vs AGLN250V2-VQ100I

AGLN250V2-VQ100 Related Parts

AGLN250V2-VQ100 Frequently Asked Questions (FAQ)

  • The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near a thermal pad or heat sink to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer.

  • To ensure reliable operation, follow the recommended operating conditions, use a suitable thermal design, and consider using a temperature sensor to monitor the device temperature. Also, ensure that the power supply is stable and within the recommended voltage range.

  • The AGLN250V2-VQ100 is designed to meet the radiation hardness requirements for space and high-reliability applications. It has a total ionizing dose (TID) rating of 100 krad(Si) and a single event effect (SEE) rating of 37 MeV-cm²/mg.

  • Yes, the AGLN250V2-VQ100 can be used in non-space applications that require high reliability and radiation tolerance. However, it's essential to evaluate the device's performance and radiation tolerance in the specific application environment.

  • Handle the device with ESD-protective equipment and follow standard ESD handling procedures. The device has a human body model (HBM) ESD rating of 2 kV and a charged device model (CDM) ESD rating of 500 V.

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