Part Details for AGLN060V5-VQG100 by Microchip Technology Inc
Results Overview of AGLN060V5-VQG100 by Microchip Technology Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Environmental Monitoring
Space Technology
Telecommunications
AGLN060V5-VQG100 Information
AGLN060V5-VQG100 by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for AGLN060V5-VQG100
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1100-1130-ND
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DigiKey | IC FPGA 71 I/O 100VQFP Min Qty: 270 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$14.6200 | Buy Now |
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DISTI #
AGLN060V5-VQG100
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Avnet Americas | FPGA IGLOO nano Family 60K Gates 130nm (CMOS) Technology 1.5V 100-Pin VQFP - Trays (Alt: AGLN060V5-VQG100) RoHS: Compliant Min Qty: 270 Package Multiple: 90 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$9.4068 / $10.0500 | Buy Now |
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DISTI #
AGLN060V5-VQG100
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Microchip Technology Inc | IGLOO Nano FPGA, 700LEs, TQFP, Projected EOL: 2049-02-04 COO: Thailand ECCN: EAR99 RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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$6.4800 / $19.1400 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$9.9600 / $20.7500 | Buy Now |
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NAC | AGLN060V5-VQG100 RoHS: Compliant Min Qty: 90 Package Multiple: 90 Container: Tray | 0 |
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$9.8000 / $11.8200 | Buy Now |
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Cytech Systems Limited | IC FPGA 71 I/O 100VQFP | 250 |
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RFQ | |
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DISTI #
AGLN060V5-VQG100
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EBV Elektronik | FPGA IGLOO nano Family 60K Gates 130nm CMOS Technology 15V 100Pin VQFP (Alt: AGLN060V5-VQG100) RoHS: Compliant Min Qty: 270 Package Multiple: 90 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Master Electronics | RoHS: Compliant | 0 |
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$9.9600 / $20.7500 | Buy Now |
Part Details for AGLN060V5-VQG100
AGLN060V5-VQG100 CAD Models
AGLN060V5-VQG100 Part Data Attributes
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AGLN060V5-VQG100
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
AGLN060V5-VQG100
Microchip Technology Inc
Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 12 Weeks | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1536 | |
| Number of Equivalent Gates | 60000 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Organization | 1536 CLBS, 60000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |
Alternate Parts for AGLN060V5-VQG100
This table gives cross-reference parts and alternative options found for AGLN060V5-VQG100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AGLN060V5-VQG100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| AGLN060V5-VQ100 | Microchip Technology Inc | $12.4384 | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100 | AGLN060V5-VQG100 vs AGLN060V5-VQ100 |
| AGLN060V5-VQ100I | Microchip Technology Inc | $14.3910 | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100 | AGLN060V5-VQG100 vs AGLN060V5-VQ100I |
| AGLN060V5-VQG100I | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100 | AGLN060V5-VQG100 vs AGLN060V5-VQG100I |
| AGLN060V5-VQ100I | Actel Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 250MHz, 1536-Cell, CMOS, PQFP100, 14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, VQFP-100 | AGLN060V5-VQG100 vs AGLN060V5-VQ100I |
| AGLN060V5-VQ100 | Actel Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 250MHz, 1536-Cell, CMOS, PQFP100, 14 X 14 MM, 0.5 MM PITCH, 1.2 MM HEIGHT, VQFP-100 | AGLN060V5-VQG100 vs AGLN060V5-VQ100 |
| AGLN060V5-ZVQ100I | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100 | AGLN060V5-VQG100 vs AGLN060V5-ZVQ100I |
| AGLN060V5-ZVQG100I | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100 | AGLN060V5-VQG100 vs AGLN060V5-ZVQG100I |
AGLN060V5-VQG100 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
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To ensure reliable operation across the entire temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a stable temperature.
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To minimize EMI and RFI, use a shielded enclosure, and ensure that the PCB is designed with EMI and RFI in mind. Use a multi-layer PCB with a solid ground plane, and consider using EMI filters or shielding components to reduce emissions.
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To ensure proper power sequencing and voltage ramp-up, follow the recommended power-up and power-down sequences outlined in the datasheet. Use a power sequencing controller or a voltage supervisor to ensure that the device is powered up and down correctly.
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To ensure reliable PCB assembly and rework, follow the recommended soldering and rework procedures outlined in the datasheet. Use a soldering iron with a temperature-controlled tip, and avoid applying excessive heat or force during rework.