Part Details for AGLN020V2-QNG68 by Microsemi Corporation
Results Overview of AGLN020V2-QNG68 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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AGLN020V2-QNG68 Information
AGLN020V2-QNG68 by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for AGLN020V2-QNG68
AGLN020V2-QNG68 CAD Models
AGLN020V2-QNG68 Part Data Attributes
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AGLN020V2-QNG68
Microsemi Corporation
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Datasheet
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AGLN020V2-QNG68
Microsemi Corporation
Field Programmable Gate Array, 520 CLBs, 20000 Gates, CMOS, 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-XQCC-N68 | |
| Length | 8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 520 | |
| Number of Equivalent Gates | 20000 | |
| Number of Terminals | 68 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Organization | 520 CLBS, 20000 GATES | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC68,.32SQ,16 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Width | 8 mm |
Alternate Parts for AGLN020V2-QNG68
This table gives cross-reference parts and alternative options found for AGLN020V2-QNG68. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AGLN020V2-QNG68, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| AGLN020V2-QNG68 | Actel Corporation | Check for Price | Field Programmable Gate Array, 520 CLBs, 20000 Gates, 250MHz, 520-Cell, CMOS, 8 X 8 MM, 0.9 MM HEIGHT, 0.4 MM PITCH, GREEN, QFN-68 | AGLN020V2-QNG68 vs AGLN020V2-QNG68 |
AGLN020V2-QNG68 Frequently Asked Questions (FAQ)
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A good PCB layout should ensure minimal signal routing, use of thermal vias, and a solid ground plane. Thermal management involves using a heat sink, thermal interface material, and ensuring good airflow around the device.
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Use controlled impedance routing, add decoupling capacitors, and implement EMI shielding. Also, ensure that the device is placed away from noise sources and that the PCB is designed with EMI mitigation in mind.
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Follow the power-up sequence recommended in the datasheet, ensuring that the power supplies are stable before enabling the device. Power-down sequencing should be done in reverse order, with a delay between each step to ensure a clean shutdown.
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Use a logic analyzer or oscilloscope to capture signal waveforms, and verify that the device is receiving the correct input signals. Check the power supply and clock signals, and ensure that the device is properly configured and initialized.
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Temperature, humidity, and vibration can affect the device's performance and reliability. Ensure that the device operates within the recommended temperature range, and that the PCB is designed to withstand environmental stresses.