Part Details for AGLN010V2-UCG36 by Microchip Technology Inc
Results Overview of AGLN010V2-UCG36 by Microchip Technology Inc
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Audio and Video Systems
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Entertainment and Gaming
Automotive
AGLN010V2-UCG36 Information
AGLN010V2-UCG36 by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for AGLN010V2-UCG36
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
35AJ2211
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Newark | Igloo Nano Fpga, 100Les 36 Vfbga 3X3X0.8Mm Tray Rohs Compliant: Yes |Microchip AGLN010V2-UCG36 RoHS: Compliant Min Qty: 980 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$6.1300 | Buy Now |
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DISTI #
AGLN010V2-UCG36
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Avnet Americas | FPGA IGLOO nano Family 10K Gates 130nm (CMOS) Technology 1.2V/1.5V 36-Pin UCSP - Trays (Alt: AGLN010V2-UCG36) RoHS: Compliant Min Qty: 980 Package Multiple: 490 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$5.1246 / $5.4750 | Buy Now |
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DISTI #
494-AGLN010V2-UCG36
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Mouser Electronics | FPGA - Field Programmable Gate Array IGLOO Nano FPGA, 100LEs RoHS: Compliant | 0 |
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$7.2500 | Order Now |
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DISTI #
AGLN010V2-UCG36
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Microchip Technology Inc | IGLOO Nano FPGA, 100LEs, VFBGA, Projected EOL: 2049-02-04 COO: Philippines ECCN: EAR99 RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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$3.2100 / $9.4800 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$5.4400 / $14.8900 | Buy Now |
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NAC | AGLN010V2-UCG36 RoHS: Compliant Min Qty: 490 Package Multiple: 490 Container: Tray | 0 |
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$5.3400 / $6.4400 | Buy Now |
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DISTI #
AGLN010V2-UCG36
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Avnet Silica | FPGA IGLOO nano Family 10K Gates 130nm CMOS Technology 12V15V 36Pin UCSP (Alt: AGLN010V2-UCG36) RoHS: Compliant Min Qty: 980 Package Multiple: 490 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
AGLN010V2-UCG36
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EBV Elektronik | FPGA IGLOO nano Family 10K Gates 130nm CMOS Technology 12V15V 36Pin UCSP (Alt: AGLN010V2-UCG36) RoHS: Compliant Min Qty: 980 Package Multiple: 490 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Master Electronics | RoHS: Compliant | 0 |
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$5.4400 / $14.8900 | Buy Now |
Part Details for AGLN010V2-UCG36
AGLN010V2-UCG36 CAD Models
AGLN010V2-UCG36 Part Data Attributes
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AGLN010V2-UCG36
Microchip Technology Inc
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Datasheet
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AGLN010V2-UCG36
Microchip Technology Inc
Field Programmable Gate Array, 260 CLBs, 10000 Gates, CMOS, PBGA36
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | 3 X 3 MM, 0.80 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, UCSP-36 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 12 Weeks | |
| JESD-30 Code | S-PBGA-B36 | |
| Length | 3 mm | |
| Number of CLBs | 260 | |
| Number of Equivalent Gates | 10000 | |
| Number of Terminals | 36 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Organization | 260 CLBS, 10000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA36,6X6,16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Packing Method | TRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.8 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3 mm |
AGLN010V2-UCG36 Frequently Asked Questions (FAQ)
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Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a heat sink if necessary, and consider derating the device's power consumption according to the datasheet's thermal derating curve.
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The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input signals. This sequence helps prevent latch-up and ensures proper device operation.
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To troubleshoot output signal integrity issues, check the PCB layout for signal routing and termination, ensure proper power supply decoupling, and verify that the output load is within the recommended specifications. You can also use simulation tools or oscilloscope measurements to analyze the signal quality.
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Yes, it's essential to follow proper ESD handling procedures when handling the AGLN010V2-UCG36, such as using an ESD wrist strap, ESD mat, or ESD bag, and ensuring that the device is stored in an ESD-protected environment.