Part Details for AGLN010V2-QNG48I by Microsemi Corporation
Results Overview of AGLN010V2-QNG48I by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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AGLN010V2-QNG48I Information
AGLN010V2-QNG48I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for AGLN010V2-QNG48I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | FPGA IGLOO nano Family 10K Gates 130nm Technology 1.2V/1.5V 48-Pin QFN EP Tray / IC FPGA 34 I/O 48QFN | 2600 |
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$79.2469 / $97.5340 | Buy Now |
Part Details for AGLN010V2-QNG48I
AGLN010V2-QNG48I CAD Models
AGLN010V2-QNG48I Part Data Attributes
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AGLN010V2-QNG48I
Microsemi Corporation
Buy Now
Datasheet
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AGLN010V2-QNG48I
Microsemi Corporation
Field Programmable Gate Array, 260 CLBs, 10000 Gates, CMOS, 6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-XQCC-N48 | |
| Length | 6 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 260 | |
| Number of Equivalent Gates | 10000 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 260 CLBS, 10000 GATES | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC48,.24SQ,16 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Width | 6 mm |
Alternate Parts for AGLN010V2-QNG48I
This table gives cross-reference parts and alternative options found for AGLN010V2-QNG48I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AGLN010V2-QNG48I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| AGLN010V2-QNG48I | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 260 CLBs, 10000 Gates, CMOS | AGLN010V2-QNG48I vs AGLN010V2-QNG48I |
| AGLN010V2-QNG48I | Actel Corporation | Check for Price | Field Programmable Gate Array, 260 CLBs, 10000 Gates, 250MHz, 260-Cell, CMOS, 6 X 6 MM, 0.9 MM HEIGHT, 0.4 MM PITCH, GREEN, QFN-48 | AGLN010V2-QNG48I vs AGLN010V2-QNG48I |
| AGLN010V2-QN48I | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 260 CLBs, 10000 Gates, 250MHz, 260-Cell, CMOS | AGLN010V2-QNG48I vs AGLN010V2-QN48I |
| AGLN010V2-QNG48 | Actel Corporation | Check for Price | Field Programmable Gate Array, 260 CLBs, 10000 Gates, 250MHz, 260-Cell, CMOS, 6 X 6 MM, 0.9 MM HEIGHT, 0.4 MM PITCH, GREEN, QFN-48 | AGLN010V2-QNG48I vs AGLN010V2-QNG48 |
AGLN010V2-QNG48I Frequently Asked Questions (FAQ)
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The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a heat sink or a thermal interface material.
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To ensure signal integrity and minimize EMI, use differential signaling, keep clock lines short, and use a common mode filter. Also, use a shielded enclosure and ensure the PCB is designed with EMI reduction in mind.
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The power-up sequence should be VCC, then VCCA, and finally VCCIO. The power-down sequence should be the reverse. Ensure that VCC is powered up before VCCA and VCCIO, and that VCC is powered down after VCCA and VCCIO.
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Use a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL). Ensure the clock signal is clean and has minimal jitter. Use a clock buffer or a clock distribution network to minimize skew and ensure reliable clocking.
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The input termination resistors should be 50 ohms, and the output termination resistors should be 50 ohms or 75 ohms, depending on the specific application and signal requirements.