Part Details for AGL600V5-FG256I by Microsemi Corporation
Results Overview of AGL600V5-FG256I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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AGL600V5-FG256I Information
AGL600V5-FG256I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for AGL600V5-FG256I
AGL600V5-FG256I CAD Models
AGL600V5-FG256I Part Data Attributes
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AGL600V5-FG256I
Microsemi Corporation
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Datasheet
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AGL600V5-FG256I
Microsemi Corporation
Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Microsemi Corporation | |
Clock Frequency-Max | 108 MHz | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 13824 | |
Number of Equivalent Gates | 600000 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 13824 CLBS, 600000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 225 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.8 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 17 mm |
Alternate Parts for AGL600V5-FG256I
This table gives cross-reference parts and alternative options found for AGL600V5-FG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AGL600V5-FG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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AGL600V5-FGG256 | Microchip Technology Inc | $111.3699 | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256 | AGL600V5-FG256I vs AGL600V5-FGG256 |
AGL600V5-FG256 | Microchip Technology Inc | $111.3699 | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256 | AGL600V5-FG256I vs AGL600V5-FG256 |
AGL600V5-FGG256I | Microchip Technology Inc | $128.0891 | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256 | AGL600V5-FG256I vs AGL600V5-FGG256I |
AGL600V5-FG256I | Microchip Technology Inc | $128.0891 | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256 | AGL600V5-FG256I vs AGL600V5-FG256I |
AGL600V5-FGG256I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | AGL600V5-FG256I vs AGL600V5-FGG256I |
AGL600V5-FGG256I | Actel Corporation | Check for Price | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, 13824-Cell, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | AGL600V5-FG256I vs AGL600V5-FGG256I |
AGL600V5-FG256 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | AGL600V5-FG256I vs AGL600V5-FG256 |
AGL600V5-FGG256 | Actel Corporation | Check for Price | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, 13824-Cell, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | AGL600V5-FG256I vs AGL600V5-FGG256 |
AGL600V5-FG256 | Actel Corporation | Check for Price | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, 13824-Cell, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | AGL600V5-FG256I vs AGL600V5-FG256 |
AGL600V5-FGG256 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 108MHz, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | AGL600V5-FG256I vs AGL600V5-FGG256 |
AGL600V5-FG256I Frequently Asked Questions (FAQ)
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Microsemi provides a reference design guide and thermal management guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and signal integrity.
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Microsemi provides a comprehensive development environment, Libero SoC, which includes tools for design entry, synthesis, place-and-route, and verification. Engineers can use this environment to implement and verify their design, and also leverage the extensive documentation and tutorials provided by Microsemi.
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The AGL600V5-FG256I requires a specific power sequencing and voltage regulation scheme to ensure proper operation. Engineers should refer to the power management guidelines in the datasheet and application notes, and consider using a power management IC (PMIC) specifically designed for FPGAs, such as the Microsemi Power Manager.
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To ensure signal integrity and minimize EMI, engineers should follow best practices for PCB design, such as using differential signaling, impedance matching, and shielding. They should also consider using EMI filters and ferrite beads, and follow the guidelines provided in Microsemi's application notes and design guides.
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The AGL600V5-FG256I has built-in security features, such as bitstream encryption and authentication, to protect the FPGA configuration and IP. Engineers should also consider implementing additional security measures, such as secure boot mechanisms and access control, to ensure the integrity and confidentiality of their design.