Part Details for AFS250-FGG256 by Microchip Technology Inc
Results Overview of AFS250-FGG256 by Microchip Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Environmental Monitoring
AFS250-FGG256 Information
AFS250-FGG256 by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for AFS250-FGG256
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1100-1075-ND
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DigiKey | IC FPGA 114 I/O 256FBGA Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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NAC | AFS250-FGG256 RoHS: Compliant Min Qty: 90 Package Multiple: 1 Container: Tray | 0 |
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RFQ | |
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DISTI #
AFS250-FGG256
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Avnet Silica | FPGA Fusion Family 250K Gates 10989MHz 130nm CMOS Technology 15V 256Pin FBGA (Alt: AFS250-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
AFS250-FGG256
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EBV Elektronik | FPGA Fusion Family 250K Gates 10989MHz 130nm CMOS Technology 15V 256Pin FBGA (Alt: AFS250-FGG256) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for AFS250-FGG256
AFS250-FGG256 CAD Models
AFS250-FGG256 Part Data Attributes
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AFS250-FGG256
Microchip Technology Inc
Buy Now
Datasheet
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AFS250-FGG256
Microchip Technology Inc
Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PBGA256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 12 Weeks | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 6144 | |
| Number of Equivalent Gates | 250000 | |
| Number of Inputs | 114 | |
| Number of Outputs | 114 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 6144 CLBS, 250000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.68 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for AFS250-FGG256
This table gives cross-reference parts and alternative options found for AFS250-FGG256. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AFS250-FGG256, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| AFS250-FG256 | Microchip Technology Inc | $127.6961 | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PBGA256 | AFS250-FGG256 vs AFS250-FG256 |
| AFS250-FGG256 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, 350MHz, 6144-Cell, CMOS, PBGA256, 1 MM PITCH, GREEN, FBGA-256 | AFS250-FGG256 vs AFS250-FGG256 |
| AFS250-FG256 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 6144 CLBs, 250000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256 | AFS250-FGG256 vs AFS250-FG256 |
AFS250-FGG256 Frequently Asked Questions (FAQ)
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The recommended operating temperature range for AFS250-FGG256 is -40°C to +125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range.
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To ensure reliable communication, implement proper noise reduction techniques such as shielding, grounding, and filtering. Additionally, consider using differential signaling, such as RS-485, and ensure that the signal lines are properly terminated.
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The AFS250-FGG256 supports a maximum clock frequency of 100 MHz, as specified in the datasheet. However, it's essential to ensure that the clock signal meets the device's input requirements and that the system is designed to handle the resulting data transfer rates.
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To configure the AFS250-FGG256 for low-power operation, refer to the datasheet's power management section. Enable the power-saving features, such as the sleep mode, and optimize the clock frequency and voltage supply to minimize power consumption.
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For optimal performance and signal integrity, follow a careful layout and routing strategy. Keep signal lines short, use controlled impedance, and avoid crossing signal lines over each other. Refer to the datasheet's layout and routing guidelines for more information.