Part Details for AFBR-5715APZ by Foxconn Interconnect Technology Limited
Results Overview of AFBR-5715APZ by Foxconn Interconnect Technology Limited
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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AFBR-5715APZ Information
AFBR-5715APZ by Foxconn Interconnect Technology Limited is a Fiber Optic Transceiver.
Fiber Optic Transceivers are under the broader part category of Fiber Optics.
Fiber optics are thin glass strands used to transmit light signals over long distances, enabling high-speed data transfer. There are two main types—single mode and multimode fibers. Read more about Fiber Optics on our Fiber Optics part category page.
Part Details for AFBR-5715APZ
AFBR-5715APZ CAD Models
AFBR-5715APZ Part Data Attributes
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AFBR-5715APZ
Foxconn Interconnect Technology Limited
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Datasheet
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AFBR-5715APZ
Foxconn Interconnect Technology Limited
TXRX OPTICAL SFP DMI IND BAIL
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | FOXCONN INTERCONNECT TECHNOLOGY LTD | |
| Reach Compliance Code | unknown | |
| Samacsys Manufacturer | Foxconn | |
| Body Breadth | 16.25 mm | |
| Body Height | 12.1 mm | |
| Body Length or Diameter | 42.3 mm | |
| Built-in Feature | AMPLIFIER | |
| Communication Standard | GR-468 | |
| Connection Type | LC CONNECTOR | |
| Data Rate (Tx) | 1250 Mbps | |
| Emitter/Detector Type | LASER DIODE | |
| Fiber Optic Device Type | TRANSCEIVER | |
| Fiber Type | 50/125, MMF | |
| JESD-609 Code | e4 | |
| Mounting Feature | PANEL MOUNT | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Operating Wavelength-Max | 860 nm | |
| Operating Wavelength-Min | 830 nm | |
| Operating Wavelength-Nom | 850 nm | |
| Optical Power Output-Nom | 0.223 mW | |
| Sensitivity | -21 dBm | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | NO | |
| Terminal Finish | Gold (Au) |
AFBR-5715APZ Frequently Asked Questions (FAQ)
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The recommended PCB layout and footprint for the AFBR-5715APZ can be found in the Foxconn Interconnect Technology Limited's application note or design guide, which provides detailed information on pad layout, spacing, and thermal considerations.
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To ensure reliable soldering and assembly of the AFBR-5715APZ, follow the recommended soldering profile and handling procedures outlined in the datasheet, and use a qualified soldering process with a controlled temperature and humidity environment.
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The AFBR-5715APZ has a maximum junction temperature of 125°C. To ensure reliable operation, provide adequate heat sinking and thermal management, such as using a heat sink or thermal pad, and ensure good airflow around the device.
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To troubleshoot issues with the AFBR-5715APZ, follow a systematic approach, checking for proper power supply, signal integrity, and PCB layout. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the root cause of the issue.
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The AFBR-5715APZ has built-in ESD protection, but it is still important to follow proper ESD handling procedures, such as using anti-static wrist straps, mats, and packaging, to prevent damage during handling and assembly.