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Part Details for ADSP-CM403CSWZ-CF by Analog Devices Inc
Results Overview of ADSP-CM403CSWZ-CF by Analog Devices Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
ADSP-CM403CSWZ-CF Information
ADSP-CM403CSWZ-CF by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ADSP-CM403CSWZ-CF
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
ADSP-CM403CSWZ-CF-ND
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DigiKey | IC ARM CORTEX M4 FLASH 120LQFP Min Qty: 1 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$22.9247 / $32.6800 | Buy Now |
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DISTI #
V99:2348_13794040
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Arrow Electronics | SOC ARM Cortex M4 120-Pin LQFP EP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks Date Code: 2425 | Americas - 28 |
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$27.0595 | Buy Now |
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Analog Devices Inc | ARM CORTEX M4 FLASH, 13+ ENOB Package Multiple: 1 | 0 |
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$17.5300 / $32.6800 | Buy Now |
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DISTI #
ADSPCM403CSWZCF
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Richardson RFPD | DIGITAL SIGNAL PROCESSOR IC RoHS: Compliant Min Qty: 28 | 0 |
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$22.9200 / $24.4900 | Buy Now |
Part Details for ADSP-CM403CSWZ-CF
ADSP-CM403CSWZ-CF CAD Models
ADSP-CM403CSWZ-CF Part Data Attributes
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ADSP-CM403CSWZ-CF
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-CM403CSWZ-CF
Analog Devices Inc
240MHz ARM Cortex-M4 with 13+ ENOB ADC, LQFP120
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | HLFQFP, | |
| Pin Count | 120 | |
| Manufacturer Package Code | SW-120-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Address Bus Width | 5 | |
| Barrel Shifter | NO | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 60 MHz | |
| External Data Bus Width | 16 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PQFP-G120 | |
| Length | 14 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 17 | |
| Number of External Interrupts | 6 | |
| Number of Serial I/Os | 5 | |
| Number of Terminals | 120 | |
| Number of Timers | 11 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Equivalence Code | HQFP120,.63SQ,16 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 393216 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |
ADSP-CM403CSWZ-CF Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDDR. This ensures proper power-up and initialization of the device.
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Optimizing performance requires understanding the application's requirements and configuring the device accordingly. This includes selecting the appropriate clock frequency, configuring the cache, and optimizing memory access patterns.
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The device has a maximum junction temperature of 125°C. Ensure proper heat sinking, airflow, and thermal interface material to maintain a safe operating temperature. Monitor the device's temperature using the on-chip thermal sensor.
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Follow proper PCB design and layout guidelines, use shielding and filtering, and ensure proper grounding and decoupling to minimize electromagnetic interference (EMI) and ensure EMC compliance.
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The device is rated for industrial temperature range (-40°C to 85°C). For harsh environments, consider using conformal coating, potting, or hermetic packaging to protect the device from moisture, vibration, and extreme temperatures.