Datasheets
ADSP-BF707BBCZ-3 by: Analog Devices Inc

Low Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM & DDR2/LPDDR Interface

Part Details for ADSP-BF707BBCZ-3 by Analog Devices Inc

Results Overview of ADSP-BF707BBCZ-3 by Analog Devices Inc

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ADSP-BF707BBCZ-3 Information

ADSP-BF707BBCZ-3 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
ADSP-2105BPZ-80RL Rochester Electronics LLC ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
ADSP-2105BPZ-80 Rochester Electronics LLC ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
ADSP-2101BPZ-100 Rochester Electronics LLC ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)

Price & Stock for ADSP-BF707BBCZ-3

Part # Distributor Description Stock Price Buy
DISTI # 505-ADSP-BF707BBCZ-3-ND
DigiKey IC DSP LP 1024KB L2SR 184BGA Min Qty: 1 Lead time: 10 Weeks Container: Tray 103
In Stock
  • 1 $23.3800
  • 10 $19.4590
  • 41 $17.6983
  • 123 $16.6618
  • 287 $16.0367
  • 533 $15.6619
$15.6619 / $23.3800 Buy Now
DISTI # 584-ADSP-BF707BBCZ-3
Mouser Electronics Digital Signal Processors & Controllers - DSP, DSC Low Cost sngl core BF+ w/Large Int'l mem RoHS: Compliant 0
  • 1 $16.3600
  • 10 $15.1800
  • 189 $15.1700
$15.1700 / $16.3600 Order Now
Analog Devices Inc Low Cost sngl core BF+ w/Large Package Multiple: 1 1719
  • 1 $16.3600
  • 10 $15.1750
  • 1,000 $11.5300
$11.5300 / $16.3600 Buy Now
DISTI # 77890541
Verical DSP 16bit/32bit 300MHz 184-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 41 Package Multiple: 41 Americas - 1681
  • 41 $15.2704
$15.2704 Buy Now
DISTI # ADSP-BF707BBCZ3
Richardson RFPD MICROCONTROLLER IC RoHS: Compliant Min Qty: 41 0
  • 41 $16.9600
  • 100 $16.5100
  • 500 $16.0900
  • 1,000 $15.8700
$15.8700 / $16.9600 Buy Now

Part Details for ADSP-BF707BBCZ-3

ADSP-BF707BBCZ-3 CAD Models

ADSP-BF707BBCZ-3 Part Data Attributes

ADSP-BF707BBCZ-3 Analog Devices Inc
Buy Now Datasheet
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ADSP-BF707BBCZ-3 Analog Devices Inc Low Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM & DDR2/LPDDR Interface
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Package Description CSBGA-184
Pin Count 184
Manufacturer Package Code BC-184-1
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Samacsys Manufacturer Analog Devices
Address Bus Width 14
Barrel Shifter YES
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 60 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B184
JESD-609 Code e1
Length 12 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Serial I/Os 4
Number of Terminals 184
Number of Timers 8
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA184,14X14,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
ROM Programmability FLASH
Seated Height-Max 1.7 mm
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF707BBCZ-3 Related Parts

ADSP-BF707BBCZ-3 Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply VDD_INT (internal voltage) first, followed by VDD_DDR (DDR memory voltage), and then VDD_CORE (core voltage). This ensures proper device operation and prevents latch-up.

  • To optimize performance, consider factors such as clock frequency, cache usage, and memory access patterns. Use the VisualDSP++ development environment to analyze and optimize your code. Additionally, consult the ADSP-BF707BBCZ-3's hardware reference manual and software documentation for guidance on optimizing performance-critical code.

  • The ADSP-BF707BBCZ-3 has a maximum junction temperature (TJ) of 125°C. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB layout. Consult the datasheet and thermal management application notes for more information.

  • To ensure reliable booting, follow the guidelines in the ADSP-BF707BBCZ-3's hardware reference manual for configuring the boot mode pins and flash memory interface. Additionally, use a reliable flash memory device and ensure that the boot code is correctly programmed and verified.

  • The ADSP-BF707BBCZ-3 is designed to meet various EMC standards, such as EN 55022 and FCC Part 15. To ensure EMC compliance, follow proper PCB design and layout guidelines, use shielding and filtering as needed, and consult the ADSP-BF707BBCZ-3's EMC application notes.

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