Datasheets
ADSP-BF706BCPZ-4 by: Analog Devices Inc

Low Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM

Part Details for ADSP-BF706BCPZ-4 by Analog Devices Inc

Results Overview of ADSP-BF706BCPZ-4 by Analog Devices Inc

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ADSP-BF706BCPZ-4 Information

ADSP-BF706BCPZ-4 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
ADSP-2105BPZ-80RL Rochester Electronics LLC ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
ADSP-2105BPZ-80 Rochester Electronics LLC ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
ADSP-2101BPZ-100 Rochester Electronics LLC ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)

Price & Stock for ADSP-BF706BCPZ-4

Part # Distributor Description Stock Price Buy
DISTI # 60AK5637
Newark Embedded Processor, 400Mhz, 43I/O, Lfcsp, Dsp Type:Core, Data Bus Width:-, Operating Frequency Max:-, Ic Case/Package:Lfcsp-Ep, No. Of Pins:88Pins, No. Of Mips:-, Interfaces:-, Ram Memory Size:-, No. Of Cores:-, Qualification:- Rohs Compliant: Yes |Analog Devices ADSP-BF706BCPZ-4 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 34
  • 1 $25.0700
  • 5 $21.9000
  • 10 $18.7300
  • 25 $15.3100
  • 50 $14.9600
  • 100 $14.6200
  • 250 $14.2700
$14.2700 / $25.0700 Buy Now
DISTI # 505-ADSP-BF706BCPZ-4-ND
DigiKey IC DSP LP 1024KB L2SR 88LFCSP Min Qty: 1 Lead time: 10 Weeks Container: Tray 1791
In Stock
  • 1 $22.1100
  • 10 $18.3930
  • 43 $16.6660
  • 129 $15.6870
  • 258 $15.1942
  • 516 $14.7847
$14.7847 / $22.1100 Buy Now
DISTI # 584-ADSP-BF706BCPZ-4
Mouser Electronics Digital Signal Processors & Controllers - DSP, DSC Low Cost sngl core BF+ w/larg int'l mem RoHS: Compliant 683
  • 1 $25.2200
  • 10 $17.5300
  • 25 $15.6300
  • 50 $15.0600
  • 168 $14.2700
$14.2700 / $25.2200 Buy Now
Analog Devices Inc Low Cost sngl core BF+ w/larg Package Multiple: 1 273
  • 1 $22.1100
  • 10 $18.3930
  • 1,000 $10.8500
$10.8500 / $22.1100 Buy Now
DISTI # 80599468
Verical DSP 16bit/32bit 400MHz 88-Pin LFCSP EP Tray RoHS: Compliant Min Qty: 43 Package Multiple: 1 Americas - 3436
  • 43 $15.0100
  • 129 $14.2400
  • 258 $13.9600
  • 516 $13.8200
$13.8200 / $15.0100 Buy Now
DISTI # ADSP-BF706BCPZ4
Richardson RFPD DIGITAL SIGNAL PROCESSOR - DEVELOPMENT TOOL RoHS: Compliant Min Qty: 1 0
  • 1 $12.6900
$12.6900 Buy Now
Cytech Systems Limited IC DSP LP 1024KB L2SR 88LFCSP 504
RFQ
Vyrian Peripheral ICs 591
RFQ
Win Source Electronics IC DSP LP 1024KB L2SR 88LFCSP 2000
  • 3 $15.0695
  • 5 $14.0972
  • 8 $13.6111
  • 11 $12.6389
  • 14 $12.1528
  • 18 $11.6667
$11.6667 / $15.0695 Buy Now

Part Details for ADSP-BF706BCPZ-4

ADSP-BF706BCPZ-4 CAD Models

ADSP-BF706BCPZ-4 Part Data Attributes

ADSP-BF706BCPZ-4 Analog Devices Inc
Buy Now Datasheet
Compare Parts:
ADSP-BF706BCPZ-4 Analog Devices Inc Low Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Package Description LFCSP-88
Pin Count 88
Manufacturer Package Code CP-88-8
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Samacsys Manufacturer Analog Devices
Address Bus Width 14
Barrel Shifter YES
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 60 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
Internal Bus Architecture MULTIPLE
JESD-30 Code S-XQCC-N88
JESD-609 Code e3
Length 12 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Serial I/Os 4
Number of Terminals 88
Number of Timers 8
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC88,.47SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
ROM Programmability FLASH
Seated Height-Max 0.9 mm
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 12 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

Alternate Parts for ADSP-BF706BCPZ-4

This table gives cross-reference parts and alternative options found for ADSP-BF706BCPZ-4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADSP-BF706BCPZ-4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
ADSP-BF706KCPZ-4 Analog Devices Inc $8.4999 Low Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM ADSP-BF706BCPZ-4 vs ADSP-BF706KCPZ-4

ADSP-BF706BCPZ-4 Related Parts

ADSP-BF706BCPZ-4 Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply VDD_INT and VDD_DDR simultaneously, followed by VDD_CORE and VDD_PLL. This ensures proper power-up and minimizes the risk of latch-up or other damage.

  • Optimizing performance involves understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache, and optimizing memory access patterns. Consult the ADSP-BF706BCPZ-4's software development kit (SDK) and application notes for guidance.

  • The ADSP-BF706BCPZ-4 has a maximum junction temperature of 125°C. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB layout. Consult the datasheet and thermal management application notes for more information.

  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering as needed. Consult the ADSP-BF706BCPZ-4's EMC application notes and relevant industry standards (e.g., IEC 61000-4-2) for guidance.

  • When using the ADSP-BF706BCPZ-4 in a harsh environment, consider the operating temperature range, humidity, and vibration. Ensure the processor is properly packaged and sealed, and that the PCB is designed to withstand the environmental stresses. Consult the datasheet and relevant industry standards (e.g., IEC 60068-2-1) for guidance.

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