Part Details for ADSP-BF701BBCZ-2 by Analog Devices Inc
Results Overview of ADSP-BF701BBCZ-2 by Analog Devices Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
ADSP-BF701BBCZ-2 Information
ADSP-BF701BBCZ-2 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ADSP-BF701BBCZ-2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
505-ADSP-BF701BBCZ-2-ND
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DigiKey | IC DSP LP 128KB L2SR 184BGA Min Qty: 58 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$12.4433 | Buy Now |
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DISTI #
584-ADSP-BF701BBCZ-2
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC LowPower BF+Embedded Proc W/128KB L2 SRA RoHS: Compliant | 0 |
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$10.8700 / $20.0600 | Order Now |
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DISTI #
V99:2348_07093919
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Arrow Electronics | DSP 16bit/32bit 200MHz 184-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 10 Weeks Date Code: 1531 | Americas - 16 |
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$2.0850 / $10.9584 | Buy Now |
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Analog Devices Inc | LowPower BF+Embedded Proc W/12 Package Multiple: 1 | 3114 |
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$8.0900 / $8.3900 | Buy Now |
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DISTI #
26620584
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Verical | DSP 16bit/32bit 200MHz 184-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 58 Package Multiple: 58 | Americas - 3074 |
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$10.5380 | Buy Now |
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DISTI #
25859036
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Verical | DSP 16bit/32bit 200MHz 184-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1531 | Americas - 16 |
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$18.2607 | Buy Now |
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Rochester Electronics | BLACKFIN Embedded Processor RoHS: Compliant Status: Active Min Qty: 1 | 26 |
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$8.9700 / $11.2100 | Buy Now |
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DISTI #
ADSP-BF701BBCZ2
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Richardson RFPD | MICROCONTROLLER IC RoHS: Compliant Min Qty: 58 | 0 |
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$11.1400 / $11.9000 | Buy Now |
Part Details for ADSP-BF701BBCZ-2
ADSP-BF701BBCZ-2 CAD Models
ADSP-BF701BBCZ-2 Part Data Attributes
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ADSP-BF701BBCZ-2
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-BF701BBCZ-2
Analog Devices Inc
Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | CSBGA-184 | |
| Pin Count | 184 | |
| Manufacturer Package Code | BC-184-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Address Bus Width | 14 | |
| Barrel Shifter | YES | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 60 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B184 | |
| JESD-609 Code | e1 | |
| Length | 12 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Serial I/Os | 4 | |
| Number of Terminals | 184 | |
| Number of Timers | 8 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA184,14X14,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
ADSP-BF701BBCZ-2 Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VDD_INT (internal voltage) first, followed by VDD_DDR (DDR memory voltage), and then VDD_CORE (core voltage). This sequence helps to ensure proper device operation and prevents latch-up conditions.
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To optimize performance, consider the following: (1) use the highest possible clock frequency, (2) optimize memory access patterns, (3) use the cache effectively, (4) minimize interrupts and context switching, and (5) use the built-in performance counters to identify bottlenecks.
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The FPU has some limitations, including: (1) it only supports single-precision floating-point operations, (2) it does not support denormal numbers, and (3) it has a limited range of exponent values. Be sure to review the datasheet and programming manual for more information on FPU usage.
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To ensure reliable data transfer, use the following best practices: (1) use a consistent clock domain, (2) implement proper handshaking and synchronization, (3) use error detection and correction mechanisms, and (4) follow the recommended interface timing specifications.
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To manage thermal issues, consider the following: (1) use a heat sink or thermal interface material, (2) ensure good airflow around the device, (3) reduce power consumption by optimizing code and using low-power modes, and (4) monitor the device temperature using the built-in thermal sensor.