Part Details for ADSP-BF606KBCZ-4 by Analog Devices Inc
Results Overview of ADSP-BF606KBCZ-4 by Analog Devices Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ADSP-BF606KBCZ-4 Information
ADSP-BF606KBCZ-4 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ADSP-BF606KBCZ-4
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
ADSP-BF606KBCZ-4-ND
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DigiKey | IC DSP CTRLR 349CSBGA Min Qty: 1 Lead time: 10 Weeks Container: Tray |
26 In Stock |
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$26.2995 / $37.3100 | Buy Now |
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DISTI #
584-ADSP-BF606KBCZ-4
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC Blackfin Dual-core Proc W/ 128K SRAM RoHS: Compliant | 23 |
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$26.2900 / $37.3100 | Buy Now |
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Analog Devices Inc | Blackfin Dual-core Proc W/ 128 Package Multiple: 1 | 210 |
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$19.2500 / $37.3100 | Buy Now |
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DISTI #
26618853
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Verical | DSP 400MHz 349-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 24 Package Multiple: 24 | Americas - 192 |
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$25.0711 | Buy Now |
Part Details for ADSP-BF606KBCZ-4
ADSP-BF606KBCZ-4 CAD Models
ADSP-BF606KBCZ-4 Part Data Attributes
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ADSP-BF606KBCZ-4
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-BF606KBCZ-4
Analog Devices Inc
Blackfin Dual-Core Processor up to 800 MHz for High Performance Digital Signal Processing Applications
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | CSBGA-349 | |
| Pin Count | 349 | |
| Manufacturer Package Code | BC-349-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Address Bus Width | 25 | |
| Barrel Shifter | YES | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 60 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B349 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of External Interrupts | 6 | |
| Number of Serial I/Os | 3 | |
| Number of Terminals | 349 | |
| Number of Timers | 8 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA349,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 282624 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.19 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, MIXED |
ADSP-BF606KBCZ-4 Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDSP and VDDIO. This ensures proper power-up and minimizes the risk of latch-up or other damage.
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Optimizing performance requires understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache and memory, and optimizing the code for the specific use case.
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The ADSP-BF606KBCZ-4 has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking, ensure good airflow, and avoid overheating the device.
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To ensure EMC, follow proper PCB design guidelines, use shielding and filtering, and ensure that the system meets the relevant EMC standards and regulations.
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In harsh environments, consider the operating temperature range, humidity, and vibration. Ensure the system is designed to withstand these conditions, and consider using conformal coating, sealing, or other protection methods as needed.