Part Details for ADSP-2185LBSTZ-210 by Analog Devices Inc
Results Overview of ADSP-2185LBSTZ-210 by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ADSP-2185LBSTZ-210 Information
ADSP-2185LBSTZ-210 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ADSP-2185LBSTZ-210
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | 16k/16k 16 bit DSP 52 MIPS 3.3 Package Multiple: 1 | 698 |
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Buy Now | |
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Vyrian | Peripheral ICs | 1 |
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RFQ |
Part Details for ADSP-2185LBSTZ-210
ADSP-2185LBSTZ-210 CAD Models
ADSP-2185LBSTZ-210 Part Data Attributes
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ADSP-2185LBSTZ-210
Analog Devices Inc
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Datasheet
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ADSP-2185LBSTZ-210
Analog Devices Inc
16-bit, 52 MIPS, 3.3v, 2 serial ports, host port, 80 KB RAM
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | QFP | |
| Package Description | LQFP-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | ST-100-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Address Bus Width | 14 | |
| Barrel Shifter | YES | |
| Bit Size | 16 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | 24 | |
| Format | FLOATING POINT | |
| Integrated Cache | NO | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of External Interrupts | 6 | |
| Number of Terminals | 100 | |
| On Chip Data RAM Width | 16 | |
| On Chip Program ROM Width | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 8192 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
ADSP-2185LBSTZ-210 Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VDD (core voltage) first, followed by VCC (I/O voltage) and then the clock signal. This ensures proper device operation and prevents latch-up.
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To optimize for low power, use the device's power-down modes (e.g., idle, sleep, and shutdown), reduce the clock frequency, and minimize I/O activity. Additionally, use the device's voltage regulator module to reduce power consumption.
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The maximum allowed clock frequency for the ADSP-2185LBSTZ-210 is 210 MHz. However, the actual achievable frequency may vary depending on the specific application, PCB design, and environmental conditions.
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To ensure reliable data transfer, use the device's DMA controller to manage data transfer, implement error detection and correction mechanisms (e.g., ECC, CRC), and ensure proper signal integrity on the memory interface.
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To manage thermal issues, ensure good airflow around the device, use a heat sink or thermal interface material if necessary, and follow the recommended PCB design guidelines for thermal dissipation.