Datasheets
ADSP-1016AJG by:

IC 16-BIT, DSP-MULTIPLIER, CPGA68, HERMETIC SEALED, PGA-68, DSP Peripheral

Part Details for ADSP-1016AJG by Analog Devices Inc

Results Overview of ADSP-1016AJG by Analog Devices Inc

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ADSP-1016AJG Information

ADSP-1016AJG by Analog Devices Inc is a DSP Peripheral.
DSP Peripherals are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
ADSP-2105BPZ-80RL Rochester Electronics LLC ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
ADSP-2105BPZ-80 Rochester Electronics LLC ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
ADSP-2101BPZ-100 Rochester Electronics LLC ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)

Price & Stock for ADSP-1016AJG

Part # Distributor Description Stock Price Buy
DISTI # 2156-ADSP-1016AJG-ND
DigiKey 16 X 16 CMOS MULTIPLIER Min Qty: 14 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 82
In Stock
  • 14 $22.5300
$22.5300 Buy Now
Bristol Electronics   84
RFQ
Quest Components   67
  • 1 $32.7200
  • 17 $29.4480
  • 35 $27.8120
$27.8120 / $32.7200 Buy Now
Rochester Electronics 16 X 16-Bit CMOS Multiplier RoHS: Not Compliant Status: Obsolete Min Qty: 1 82
  • 25 $21.6600
  • 100 $20.5800
  • 500 $19.4900
  • 1,000 $18.4100
  • 10,000 $17.3300
$17.3300 / $21.6600 Buy Now

Part Details for ADSP-1016AJG

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ADSP-1016AJG Part Data Attributes

ADSP-1016AJG Analog Devices Inc
Buy Now Datasheet
Compare Parts:
ADSP-1016AJG Analog Devices Inc IC 16-BIT, DSP-MULTIPLIER, CPGA68, HERMETIC SEALED, PGA-68, DSP Peripheral
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ANALOG DEVICES INC
Part Package Code PGA
Package Description HERMETIC SEALED, PGA-68
Pin Count 68
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Boundary Scan NO
External Data Bus Width 16
JESD-30 Code S-CPGA-P68
JESD-609 Code e0
Length 27.81 mm
Low Power Mode NO
Number of Terminals 68
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Data Bus Width 32
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA68,11X11
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.17 mm
Supply Current-Max 65 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 27.81 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER

ADSP-1016AJG Related Parts

ADSP-1016AJG Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply VDD (core voltage) first, followed by VIO (I/O voltage) and then the clock signal. This ensures proper device initialization and prevents latch-up.

  • Optimization involves understanding the application's requirements and configuring the processor accordingly. This includes selecting the appropriate clock frequency, cache settings, and memory allocation. Additionally, optimizing code using the processor's instruction set and pipelining can also improve performance.

  • The DMA controller has limitations on the number of channels, transfer sizes, and priority levels. It's essential to understand these limitations to ensure efficient data transfer and avoid conflicts between different DMA requests.

  • Error handling and debugging can be implemented using the processor's built-in error detection mechanisms, such as parity and checksum checks. Additionally, using debug tools like the VisualDSP++ development environment and the processor's Emulation and Trace capabilities can help identify and fix issues.

  • Thermal management is crucial to ensure the processor's reliability and performance. This includes providing adequate heat sinking, airflow, and thermal interface materials to dissipate heat generated by the processor. It's also essential to monitor the processor's temperature and adjust the system design accordingly.

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