Part Details for ADSP-1009ATD/+ by Analog Devices Inc
Results Overview of ADSP-1009ATD/+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ADSP-1009ATD/+ Information
ADSP-1009ATD/+ by Analog Devices Inc is a DSP Peripheral.
DSP Peripherals are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| ADSP-2105BPZ-80RL | Rochester Electronics LLC | ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
| ADSP-2105BPZ-80 | Rochester Electronics LLC | ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
| ADSP-2101BPZ-100 | Rochester Electronics LLC | ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) |
Price & Stock for ADSP-1009ATD/+
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 1150 |
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RFQ |
Part Details for ADSP-1009ATD/+
ADSP-1009ATD/+ CAD Models
ADSP-1009ATD/+ Part Data Attributes
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ADSP-1009ATD/+
Analog Devices Inc
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Datasheet
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ADSP-1009ATD/+
Analog Devices Inc
IC 12-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CDIP64, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64, DSP Peripheral
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 | |
| Boundary Scan | NO | |
| External Data Bus Width | 12 | |
| JESD-30 Code | R-CDIP-T64 | |
| JESD-609 Code | e0 | |
| Length | 81.28 mm | |
| Low Power Mode | NO | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Data Bus Width | 27 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP64,.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 4.29 mm | |
| Supply Current-Max | 75 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 22.86 mm | |
| uPs/uCs/Peripheral ICs Type | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |