Part Details for ADAR5000ACBZ-R7 by Analog Devices Inc
Results Overview of ADAR5000ACBZ-R7 by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ADAR5000ACBZ-R7 Information
ADAR5000ACBZ-R7 by Analog Devices Inc is an RF/Microwave Splitter/Combiner.
RF/Microwave Splitter/Combiners are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for ADAR5000ACBZ-R7
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | 17-32 GHZ 1x4 splitter/combine Min Qty: 1800 Package Multiple: 1800 | 0 |
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Buy Now | |
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Vyrian | Peripheral ICs | 389 |
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RFQ |
Part Details for ADAR5000ACBZ-R7
ADAR5000ACBZ-R7 CAD Models
ADAR5000ACBZ-R7 Part Data Attributes
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ADAR5000ACBZ-R7
Analog Devices Inc
Buy Now
Datasheet
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ADAR5000ACBZ-R7
Analog Devices Inc
17 GHz to 32 GHz, 4-Way RF Splitter Combiner, CHIPS W/SOLDER BUMPS/WLCSP, 20 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | CHIPS W/SOLDER BUMPS/WLCSP | |
| Pin Count | 20 | |
| Manufacturer Package Code | CHIPS W/SOLDER BUMPS/WLCSP | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2023-04-25 | |
| RF/Microwave Device Type | SPLITTER AND COMBINER |
ADAR5000ACBZ-R7 Frequently Asked Questions (FAQ)
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A good PCB layout for the ADAR5000 involves keeping the RF signal paths as short as possible, using a solid ground plane, and minimizing the use of vias and thermal reliefs. It's also important to follow the recommended component placement and routing guidelines provided in the datasheet and application notes.
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To optimize the performance of the ADAR5000 in a high-temperature environment, it's essential to ensure good thermal management. This can be achieved by using a heat sink, improving airflow, and reducing the power consumption of the device. Additionally, the device's operating frequency and biasing conditions can be adjusted to minimize the impact of temperature on performance.
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The recommended calibration procedure for the ADAR5000 involves a series of steps, including DC offset calibration, gain calibration, and phase calibration. The specific calibration procedure may vary depending on the application and the desired level of accuracy. It's recommended to consult the datasheet and application notes for more detailed information.
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Troubleshooting common issues with the ADAR5000 involves a systematic approach, including checking the power supply, signal connections, and PCB layout. It's also essential to verify that the device is properly configured and calibrated. In some cases, it may be necessary to perform additional testing, such as spectral analysis or time-domain analysis, to identify the root cause of the issue.
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The recommended power-up sequence for the ADAR5000 involves powering up the device in a specific order, typically starting with the power supply, followed by the clock signal, and finally the enable signal. This helps to ensure that the device is properly initialized and configured for operation.