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Part Details for AD9985BSTZ-110 by Analog Devices Inc
Results Overview of AD9985BSTZ-110 by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
AD9985BSTZ-110 Information
AD9985BSTZ-110 by Analog Devices Inc is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for AD9985BSTZ-110
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | AD9985 - 110 Msps/140 MSPS Analog Interface For Flat Panel Displays RoHS: Compliant Status: Obsolete Min Qty: 1 | 3 |
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$7.7700 / $9.7100 | Buy Now |
Part Details for AD9985BSTZ-110
AD9985BSTZ-110 CAD Models
AD9985BSTZ-110 Part Data Attributes
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AD9985BSTZ-110
Analog Devices Inc
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Datasheet
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AD9985BSTZ-110
Analog Devices Inc
110 MSPS/140 MSPS Analog Interface for Flat Panel Displays
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, MS-026BEC, LQFP-80 | |
| Pin Count | 80 | |
| Manufacturer Package Code | ST-80-2 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | S-PQFP-G80 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 80 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 3.45 V | |
| Supply Voltage-Min | 3.15 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |
AD9985BSTZ-110 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star topology for the power supply and keep the power traces away from the analog signals.
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Use a high-quality clock source with a low jitter specification. Use a clock frequency that is a multiple of the pixel clock frequency to minimize jitter. Use a series resistor and capacitor to filter the clock input and reduce noise.
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Power up the digital supply (VDD) first, followed by the analog supply (AVDD). Ensure that the clock input is stable and valid before applying the analog supply. Use a power-up sequence that ensures the digital supply is stable before enabling the analog circuitry.
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Check the input signal amplitude and offset to ensure they are within the specified range. Verify that the clock frequency and phase are correct. Check for noise and distortion in the input signal. Use the chip's built-in diagnostic features, such as the ADC test mode, to isolate the issue.
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Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Avoid blocking the airflow or using a metal can or shield that can trap heat. Use a thermal interface material to improve heat transfer between the device and the heat sink.