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Part Details for AD8418AWHRMZ by Analog Devices Inc
Results Overview of AD8418AWHRMZ by Analog Devices Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
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AD8418AWHRMZ Information
AD8418AWHRMZ by Analog Devices Inc is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for AD8418AWHRMZ
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
53AK9941
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Newark | Current Sense Amp, 250Khz, Msop, Current Sense Amplifier Type:High Side, Low Side, Gain Bandwidth Product:250Khz, Ic Case/Package:Msop, No. Of Pins:8Pins, Operating Temperature Min:-40°C, Operating Temperature Max:150°C, Cmrr:100Dbrohs Compliant: Yes |Analog Devices AD8418AWHRMZ RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 229 |
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$3.0200 / $5.3800 | Buy Now |
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DISTI #
505-AD8418AWHRMZ-ND
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DigiKey | IC CURRENT SENSE 1 CIRCUIT 8MSOP Min Qty: 1 Lead time: 10 Weeks Container: Tube |
579 In Stock |
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$2.5125 / $6.4300 | Buy Now |
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DISTI #
584-AD8418AWHRMZ
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Mouser Electronics | Current Sense Amplifiers High Common Mode Cur Sense, -3V to 80V RoHS: Compliant | 50 |
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$2.5700 / $4.9200 | Buy Now |
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DISTI #
E54:1762_08516618
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Arrow Electronics | SP Amp Current Sense Amp Single ±2.75V/5.5V 8-Pin MSOP Tube Automotive AEC-Q100 RoHS: Compliant Min Qty: 100 Package Multiple: 50 Lead time: 10 Weeks Date Code: 2342 | Europe - 100 |
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$2.4620 / $3.0210 | Buy Now |
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Analog Devices Inc | High Common Mode Cur Sense, -3 Package Multiple: 50 | 116 |
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$2.5125 / $6.4300 | Buy Now |
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DISTI #
88753924
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Verical | SP Amp Current Sense Amp Single ±2.75V/5.5V 8-Pin MSOP Tube Automotive AEC-Q100 RoHS: Compliant Min Qty: 100 Package Multiple: 100 Date Code: 2342 | Americas - 100 |
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$5.4308 | Buy Now |
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NexGen Digital | 1 |
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RFQ | ||
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Cytech Systems Limited | IC CURRENT SENSE 1 CIRCUIT 8MSOP | 5000 |
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RFQ | |
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LCSC | -2V70V 250kHz Single channel MSOP-8 Current Sense Amplifiers ROHS | 39 |
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$6.1550 / $8.5759 | Buy Now |
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Vyrian | Amplifiers | 523 |
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RFQ |
Part Details for AD8418AWHRMZ
AD8418AWHRMZ CAD Models
AD8418AWHRMZ Part Data Attributes
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AD8418AWHRMZ
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
AD8418AWHRMZ
Analog Devices Inc
Bidirectional, Zero-Drift, Current Sense Amplifier
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | MSOP-8 | |
| Pin Count | 8 | |
| Manufacturer Package Code | RM-8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 260 µA | |
| Bandwidth (3dB)-Nom | 0.25 MHz | |
| Common-mode Reject Ratio-Min | 90 dB | |
| Common-mode Reject Ratio-Nom | 100 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 200 µV | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Low-Bias | NO | |
| Low-Offset | YES | |
| Micropower | NO | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.19 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.1 mm | |
| Slew Rate-Nom | 1 V/us | |
| Supply Current-Max | 4.2 mA | |
| Supply Voltage Limit-Max | 6 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Wideband | NO | |
| Width | 3 mm |
AD8418AWHRMZ Frequently Asked Questions (FAQ)
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A good PCB layout for the AD8418AWHRMZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
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To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the offset and gain trim pins accordingly. It's also important to ensure the device is operated within its specified temperature range and power supply voltage.
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The recommended power-up sequence for the AD8418AWHRMZ is to first apply the analog power supply (VCC) and then the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, preventing any potential damage or incorrect operation.
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To handle the AD8418AWHRMZ's output data, it's recommended to use a first-in, first-out (FIFO) buffer to store the output data and ensure that it's not overwritten before it's read. Additionally, implement error checking and correction mechanisms to detect and correct any errors that may occur during data transmission.
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When using the AD8418AWHRMZ in a high-temperature environment, it's essential to ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and provide adequate airflow to prevent overheating. Additionally, consider using thermal interface materials and thermal vias to improve heat dissipation.