Part Details for A3P1000-2FG256I by Microchip Technology Inc
Results Overview of A3P1000-2FG256I by Microchip Technology Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
A3P1000-2FG256I Information
A3P1000-2FG256I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A3P1000-2FG256I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ1877
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Newark | Proasic3 Fpga, 11Kles 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip A3P1000-2FG256I RoHS: Compliant Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$103.9500 / $116.9600 | Buy Now |
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DISTI #
A3P1000-2FG256I-ND
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DigiKey | IC FPGA 177 I/O 256FBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
90 In Stock |
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$118.8000 | Buy Now |
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DISTI #
A3P1000-2FG256I
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Avnet Americas | FPGA ProASIC3 Family 1M Gates 310MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA - Trays (Alt: A3P1000-2FG256I) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$96.3379 / $102.9250 | Buy Now |
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DISTI #
494-A3P1000-2FG256I
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Mouser Electronics | FPGA - Field Programmable Gate Array ProASIC3 FPGA, 11KLEs RoHS: Not Compliant | 0 |
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$118.8000 | Order Now |
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DISTI #
A3P1000-2FG256I
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Microchip Technology Inc | ProASIC3 FPGA, 11KLEs, LFBGA, Projected EOL: 2049-02-04 COO: Malaysia ECCN: 3A991.d RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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$57.1400 / $118.8000 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$104.6600 / $289.9800 | Buy Now |
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DISTI #
A3P1000-2FG256I
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IBS Electronics | A3P1000-2FG256I by Microchip is a ProASIC3 FPGA with 1,000,000 system gates, 177 I/Os, 1.575V operation, and a surface-mount FPBGA-256 package. Min Qty: 90 Package Multiple: 1 | 0 |
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$135.5900 | Buy Now |
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NAC | A3P1000-2FG256I RoHS: Compliant Min Qty: 90 Package Multiple: 90 Container: Tray | 0 |
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$100.4100 / $117.6300 | Buy Now |
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DISTI #
A3P1000-2FG256I
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Avnet Silica | FPGA ProASIC3 Family 1M Gates 310MHz 130nm CMOS Technology 15V 256Pin FBGA (Alt: A3P1000-2FG256I) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
A3P1000-2FG256I
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EBV Elektronik | FPGA ProASIC3 Family 1M Gates 310MHz 130nm CMOS Technology 15V 256Pin FBGA (Alt: A3P1000-2FG256I) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for A3P1000-2FG256I
A3P1000-2FG256I CAD Models
A3P1000-2FG256I Part Data Attributes
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A3P1000-2FG256I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
A3P1000-2FG256I
Microchip Technology Inc
Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PBGA256
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Microchip | |
| Clock Frequency-Max | 350 MHz | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 24576 | |
| Number of Equivalent Gates | 1000000 | |
| Number of Inputs | 177 | |
| Number of Outputs | 177 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Packing Method | TRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.8 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |
Alternate Parts for A3P1000-2FG256I
This table gives cross-reference parts and alternative options found for A3P1000-2FG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A3P1000-2FG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| A3P1000-2FG256II | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PBGA256 | A3P1000-2FG256I vs A3P1000-2FG256II |
| A3P1000-2FGG256IY | Microchip Technology Inc | Check for Price | Field Programmable Gate Array | A3P1000-2FG256I vs A3P1000-2FGG256IY |
| A3P1000-2FG256YM | Microsemi Corporation | Check for Price | Field Programmable Gate Array, | A3P1000-2FG256I vs A3P1000-2FG256YM |
| A3P1000-2FG256 | Actel Corporation | Check for Price | Field Programmable Gate Array, 1000000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256 | A3P1000-2FG256I vs A3P1000-2FG256 |
| A3P1000-2FG256YI | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, CMOS, PBGA256 | A3P1000-2FG256I vs A3P1000-2FG256YI |
| A3P1000-2FGG256IY | Microsemi Corporation | Check for Price | Field Programmable Gate Array, | A3P1000-2FG256I vs A3P1000-2FGG256IY |
| A3P1000-2FGG256YI | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FPBGA-256 | A3P1000-2FG256I vs A3P1000-2FGG256YI |
| A3P1000-2FG256YI | Microsemi FPGA & SoC | Check for Price | FPGA, 24576 CLBS, 1000000 GATES, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256 | A3P1000-2FG256I vs A3P1000-2FG256YI |
| A3P1000-2FGG256 | Actel Corporation | Check for Price | Field Programmable Gate Array, 1000000 Gates, CMOS, PBGA256, 1 MM PITCH, GREEN, FBGA-256 | A3P1000-2FG256I vs A3P1000-2FGG256 |
| A3P1000-2FG256YM | Microchip Technology Inc | Check for Price | Field Programmable Gate Array | A3P1000-2FG256I vs A3P1000-2FG256YM |
A3P1000-2FG256I Frequently Asked Questions (FAQ)
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Microchip provides a PCB design guide for the A3P1000-2FG256I, which recommends a 4-layer PCB stackup with a solid ground plane, and suggests using differential pairs for high-speed signals. Additionally, it's recommended to keep sensitive analog signals away from noisy digital signals.
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A simple POR circuit can be implemented using a voltage supervisor IC, such as the MIC803, which can detect the power supply voltage and generate a reset signal when the voltage is below a certain threshold. The FPGA's internal POR circuit can also be used in conjunction with an external capacitor to ensure a reliable reset.
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To ensure reliable operation, it's essential to provide adequate heat dissipation for the FPGA. This can be achieved by using a heat sink with a thermal interface material, and ensuring good airflow around the device. The PCB should also be designed to minimize thermal resistance and provide a low-impedance thermal path.
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To minimize clock skew and jitter, it's recommended to use a clock tree architecture with a central clock source, and to use differential clock signals. The FPGA's internal clock management blocks can also be used to deskew and jitter-filter the clock signals. Additionally, the PCB layout should be designed to minimize clock signal routing distances and crosstalk.
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To secure the FPGA's configuration, it's recommended to use encryption and authentication mechanisms, such as AES encryption and SHA-256 authentication. Additionally, the FPGA's configuration can be stored in a secure external memory, and the device can be programmed to use a secure boot mechanism.