Part Details for A3P1000-1FG256T by Microsemi Corporation
Results Overview of A3P1000-1FG256T by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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A3P1000-1FG256T Information
A3P1000-1FG256T by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for A3P1000-1FG256T
A3P1000-1FG256T CAD Models
A3P1000-1FG256T Part Data Attributes
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A3P1000-1FG256T
Microsemi Corporation
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Datasheet
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A3P1000-1FG256T
Microsemi Corporation
Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, 24576-Cell, CMOS, PBGA256, 1 MM PITCH, FBGA-256
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 1 MM PITCH, FBGA-256 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Clock Frequency-Max | 350 MHz | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 24576 | |
| Number of Equivalent Gates | 1000000 | |
| Number of Inputs | 177 | |
| Number of Logic Cells | 24576 | |
| Number of Outputs | 177 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.8 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN LEAD SILVER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm |
Alternate Parts for A3P1000-1FG256T
This table gives cross-reference parts and alternative options found for A3P1000-1FG256T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A3P1000-1FG256T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| A3P1000-1FG256T | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, 24576-Cell, CMOS, PBGA256 | A3P1000-1FG256T vs A3P1000-1FG256T |
| A3P1000-1FG256II | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PBGA256 | A3P1000-1FG256T vs A3P1000-1FG256II |
| A3P1000-1FGG256YT | Microsemi FPGA & SoC | Check for Price | FPGA | A3P1000-1FG256T vs A3P1000-1FGG256YT |
| A3P1000-1FG256Y | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256 | A3P1000-1FG256T vs A3P1000-1FG256Y |
| A3P1000-1FG256 | Actel Corporation | Check for Price | Field Programmable Gate Array, 1000000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256 | A3P1000-1FG256T vs A3P1000-1FG256 |
| A3P1000-1FGG256Y | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FPBGA-256 | A3P1000-1FG256T vs A3P1000-1FGG256Y |
| A3P1000-1FG256YI | Microsemi FPGA & SoC | Check for Price | FPGA, 24576 CLBS, 1000000 GATES, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256 | A3P1000-1FG256T vs A3P1000-1FG256YI |
| A3P1000-1FGG256T | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, 24576-Cell, CMOS, PBGA256, 1 MM PITCH, GREEN, FBGA-256 | A3P1000-1FG256T vs A3P1000-1FGG256T |
| A3P1000-1FG256YT | Microsemi FPGA & SoC | Check for Price | FPGA | A3P1000-1FG256T vs A3P1000-1FG256YT |
A3P1000-1FG256T Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide for the A3P1000-1FG256T, which includes recommendations for PCB layout, routing, and signal integrity. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal when the voltage is below a certain threshold. The POR circuit should be designed to ensure that the FPGA is properly reset during power-up and power-down sequences.
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The A3P1000-1FG256T has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. The thermal design should be optimized to keep the junction temperature below 85°C.
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To optimize timing closure, it's essential to follow Microsemi's timing closure guidelines, which include using the correct clock domain crossing (CDC) techniques, optimizing the placement and routing of critical signals, and using the Libero SoC design software to analyze and optimize the design's timing performance.
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The A3P1000-1FG256T has built-in security features, including a secure boot mechanism and a cryptographic engine. To ensure the security of the design, it's essential to implement secure coding practices, use secure protocols for data transmission, and follow Microsemi's security guidelines for the FPGA.