Part Details for A3P060-VQG100T by Microsemi Corporation
Results Overview of A3P060-VQG100T by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
A3P060-VQG100T Information
A3P060-VQG100T by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A3P060-VQG100T
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 58 |
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RFQ |
Part Details for A3P060-VQG100T
A3P060-VQG100T CAD Models
A3P060-VQG100T Part Data Attributes
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A3P060-VQG100T
Microsemi Corporation
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Datasheet
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A3P060-VQG100T
Microsemi Corporation
Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, 1536-Cell, CMOS, PQFP100, 0.50 MM PITCH, GREEN, VQFP-100
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | 0.50 MM PITCH, GREEN, VQFP-100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Microsemi Corporation | |
Clock Frequency-Max | 350 MHz | |
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 1536 | |
Number of Equivalent Gates | 60000 | |
Number of Inputs | 71 | |
Number of Logic Cells | 1536 | |
Number of Outputs | 71 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1536 CLBS, 60000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP100,.63SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm |
Alternate Parts for A3P060-VQG100T
This table gives cross-reference parts and alternative options found for A3P060-VQG100T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A3P060-VQG100T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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A3P060-VQG100YI | Microsemi FPGA & SoC | Check for Price | FPGA, 1536 CLBS, 60000 GATES, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VTQFP-100 | A3P060-VQG100T vs A3P060-VQG100YI |
A3P060-VQG100 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | A3P060-VQG100T vs A3P060-VQG100 |
A3P060-VQ100C | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100, 0.50 MM PITCH, VQFP-100 | A3P060-VQG100T vs A3P060-VQ100C |
A3P060-VQG100I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | A3P060-VQG100T vs A3P060-VQG100I |
A3P060-VQG100YI | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100 | A3P060-VQG100T vs A3P060-VQG100YI |
A3P060-VQ100Y | Microsemi FPGA & SoC | Check for Price | FPGA, 1536 CLBS, 60000 GATES, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VTQFP-100 | A3P060-VQG100T vs A3P060-VQ100Y |
A3P060-VQ100 | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100 | A3P060-VQG100T vs A3P060-VQ100 |
A3P060-VQ100 | Actel Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, 1536-Cell, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | A3P060-VQG100T vs A3P060-VQ100 |
A3P060-VQG100 | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100 | A3P060-VQG100T vs A3P060-VQG100 |
A3P060-VQG100IY | Microchip Technology Inc | Check for Price | Field Programmable Gate Array | A3P060-VQG100T vs A3P060-VQG100IY |
A3P060-VQG100T Frequently Asked Questions (FAQ)
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Microsemi recommends a 4-6 layer PCB stackup with a dedicated power plane, a dedicated ground plane, and signal layers in between. A minimum of 10 mils of clearance between the FPGA and other components is recommended. Additionally, a solid ground plane under the FPGA is recommended to reduce noise and improve signal integrity.
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA. The POR circuit should be designed to ensure that the FPGA is held in reset until the power supply voltage reaches a stable level.
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The A3P060-VQG100T has a maximum junction temperature of 100°C. To ensure reliable operation, the FPGA should be mounted on a PCB with a thermal relief pattern, and a heat sink or thermal interface material may be required for high-temperature or high-power applications. A thermal analysis should be performed to ensure that the FPGA operates within its specified temperature range.
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To optimize the clock tree, use the FPGA's built-in clock tree synthesis tool to generate a clock tree that minimizes skew and jitter. Additionally, use a high-quality clock source, such as a crystal oscillator, and ensure that the clock signal is properly terminated and routed on the PCB.
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A reliable and secure boot process can be implemented using a secure boot mechanism, such as AES encryption and authentication, to ensure that only authorized firmware is loaded onto the FPGA. Additionally, implement a secure key storage mechanism, such as a secure key storage IP core, to protect sensitive data.