Part Details for A3P060-VQG100 by Microsemi Corporation
Results Overview of A3P060-VQG100 by Microsemi Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
A3P060-VQG100 Information
A3P060-VQG100 by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A3P060-VQG100
Part # | Distributor | Description | Stock | Price | Buy | |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 1 |
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$6.0000 / $9.2300 | Buy Now |
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Win Source Electronics | IC FPGA 71 I/O 100VQFP | 25340 |
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$3.5459 / $5.3188 | Buy Now |
Part Details for A3P060-VQG100
A3P060-VQG100 CAD Models
A3P060-VQG100 Part Data Attributes
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A3P060-VQG100
Microsemi Corporation
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Datasheet
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A3P060-VQG100
Microsemi Corporation
Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Microsemi Corporation | |
Clock Frequency-Max | 350 MHz | |
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 1536 | |
Number of Equivalent Gates | 60000 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 1536 CLBS, 60000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 14 mm |
Alternate Parts for A3P060-VQG100
This table gives cross-reference parts and alternative options found for A3P060-VQG100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A3P060-VQG100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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A3P060-VQG100YI | Microsemi FPGA & SoC | Check for Price | FPGA, 1536 CLBS, 60000 GATES, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VTQFP-100 | A3P060-VQG100 vs A3P060-VQG100YI |
A3P060-VQ100C | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100, 0.50 MM PITCH, VQFP-100 | A3P060-VQG100 vs A3P060-VQ100C |
A3P060-VQG100I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | A3P060-VQG100 vs A3P060-VQG100I |
A3P060-VQG100YI | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PQFP100 | A3P060-VQG100 vs A3P060-VQG100YI |
A3P060-VQ100Y | Microsemi FPGA & SoC | Check for Price | FPGA, 1536 CLBS, 60000 GATES, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VTQFP-100 | A3P060-VQG100 vs A3P060-VQ100Y |
A3P060-VQ100 | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100 | A3P060-VQG100 vs A3P060-VQ100 |
A3P060-VQ100 | Actel Corporation | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, 1536-Cell, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | A3P060-VQG100 vs A3P060-VQ100 |
A3P060-VQG100 | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PQFP100 | A3P060-VQG100 vs A3P060-VQG100 |
A3P060-VQG100IY | Microchip Technology Inc | Check for Price | Field Programmable Gate Array | A3P060-VQG100 vs A3P060-VQG100IY |
A3P060-VQG100IY | Microsemi Corporation | Check for Price | Field Programmable Gate Array, | A3P060-VQG100 vs A3P060-VQG100IY |
A3P060-VQG100 Frequently Asked Questions (FAQ)
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A thermal pad is recommended under the device to improve heat dissipation. A minimum of 2oz copper thickness and a solid ground plane on the bottom layer is recommended. Additionally, thermal vias can be used to improve heat dissipation.
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A clock tree can be implemented using the device's dedicated clock resources, such as the Global Clock Network (GCN) and the Regional Clock Network (RCN). The clock tree should be designed to minimize skew and ensure that all clock domains are properly synchronized.
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The device requires a specific power sequencing order to ensure proper operation. The recommended power-up sequence is: VCCINT, VCCAUX, VCCO. The power-down sequence should be reversed. Additionally, the voltage rails should be ramped up and down slowly to prevent damage to the device.
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A reliable configuration interface can be implemented using a combination of hardware and software components. The device supports various configuration interfaces, including JTAG, SPI, and BPI. The configuration data should be stored in a non-volatile memory, such as a flash memory device.
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To ensure signal integrity in high-speed interfaces, it is recommended to use differential signaling, impedance-controlled traces, and terminations. The device's high-speed interfaces, such as PCIe and Gigabit Ethernet, require careful signal integrity analysis and simulation to ensure reliable operation.