Part Details for A3P060-FG144T by Microchip Technology Inc
Results Overview of A3P060-FG144T by Microchip Technology Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
A3P060-FG144T Information
A3P060-FG144T by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A3P060-FG144T
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
A3P060-FG144T-ND
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DigiKey | IC FPGA 96 I/O 144FBGA Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
A3P060-FG144T
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Avnet Americas | FPGA ProASIC3 Family 60K Gates 231MHz 130nm (CMOS) Technology 1.5V 144-Pin F-BGA - Bulk (Alt: A3P060-FG144T) RoHS: Not Compliant Min Qty: 3000 Package Multiple: 160 Lead time: 16 Weeks, 0 Days Container: Bulk | 0 |
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RFQ | |
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DISTI #
A3P060-FG144T
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Microchip Technology Inc | ProASIC3 FPGA, 700LEs, LFBGA, Projected EOL: 2049-02-05 COO: Malaysia ECCN: EAR99 RoHS: Compliant Lead time: 16 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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$28.9100 / $60.0800 | Buy Now |
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NAC | Infineon Only RoHS: Compliant Min Qty: 3000 Package Multiple: 1 Container: Tray | 0 |
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RFQ | |
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DISTI #
A3P060-FG144T
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Avnet Silica | FPGA ProASIC3 Family 60K Gates 231MHz 130nm CMOS Technology 15V 144Pin FBGA (Alt: A3P060-FG144T) RoHS: Not Compliant Min Qty: 160 Package Multiple: 160 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
A3P060-FG144T
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EBV Elektronik | FPGA ProASIC3 Family 60K Gates 231MHz 130nm CMOS Technology 15V 144Pin FBGA (Alt: A3P060-FG144T) RoHS: Not Compliant Min Qty: 160 Package Multiple: 160 Lead time: 17 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for A3P060-FG144T
A3P060-FG144T CAD Models
A3P060-FG144T Part Data Attributes
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A3P060-FG144T
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
A3P060-FG144T
Microchip Technology Inc
Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, 1536-Cell, CMOS, PBGA144
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Clock Frequency-Max | 350 MHz | |
| JESD-30 Code | S-PBGA-B144 | |
| JESD-609 Code | e0 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1536 | |
| Number of Equivalent Gates | 60000 | |
| Number of Inputs | 96 | |
| Number of Logic Cells | 1536 | |
| Number of Outputs | 96 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1536 CLBS, 60000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Packing Method | TRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |
Alternate Parts for A3P060-FG144T
This table gives cross-reference parts and alternative options found for A3P060-FG144T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A3P060-FG144T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| A3P060-FG144I | Microchip Technology Inc | $17.0789 | Field Programmable Gate Array, 1536 CLBs, 60000 Gates, 350MHz, CMOS, PBGA144 | A3P060-FG144T vs A3P060-FG144I |
A3P060-FG144T Frequently Asked Questions (FAQ)
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Microchip provides a PCB layout guide and reference design files for the A3P060-FG144T. It's recommended to follow the guidelines for signal layer stacking, decoupling, and routing to ensure optimal signal integrity and minimize noise.
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The A3P060-FG144T has a built-in POR circuit, but it's recommended to use an external POR circuit with a voltage supervisor IC to ensure a reliable and efficient reset. Microchip provides an application note (DS00003073A) with guidelines for implementing a POR circuit.
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The A3P060-FG144T has a thermal design power (TDP) of 1.5W. To ensure proper thermal management, use a heat sink with a thermal interface material, and follow Microchip's guidelines for thermal design and layout. Additionally, consider using thermal simulation tools to optimize the design.
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To optimize clocking architecture for low power consumption, use the FPGA's built-in clock gating and dynamic voltage frequency scaling (DVFS) features. Additionally, consider using a clock tree architecture with a single clock domain and minimizing clock frequency to reduce power consumption.
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To achieve high-speed signal integrity, follow Microchip's guidelines for signal routing, termination, and impedance matching. Use differential signaling, and consider using IBIS models and signal integrity analysis tools to optimize the design.