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Part Details for A2N7002HL-HF by Comchip Technology Corporation Ltd
Results Overview of A2N7002HL-HF by Comchip Technology Corporation Ltd
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
A2N7002HL-HF Information
A2N7002HL-HF by Comchip Technology Corporation Ltd is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for A2N7002HL-HF
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
641-A2N7002HL-HFTR-ND
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DigiKey | MOSFET N-CH 60V 300MA DFN1006-3 Min Qty: 10000 Lead time: 12 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$0.0400 / $0.0556 | Buy Now |
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DISTI #
750-A2N7002HL-HF
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Mouser Electronics | MOSFETs AUTOMOTIVE MOSFET N-CH 60V 0.3A DFN1006-3 RoHS: Compliant | 0 |
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$0.0400 / $0.3500 | Order Now |
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NAC | AUTOMOTIVE MOSFET N-CH 60V 0.3A DFN1006-3 RoHS: Compliant Min Qty: 10000 Package Multiple: 10000 | 0 |
|
$0.0440 / $0.1100 | Buy Now |
Part Details for A2N7002HL-HF
A2N7002HL-HF CAD Models
A2N7002HL-HF Part Data Attributes
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A2N7002HL-HF
Comchip Technology Corporation Ltd
Buy Now
Datasheet
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Compare Parts:
A2N7002HL-HF
Comchip Technology Corporation Ltd
Small Signal Field-Effect Transistor,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | COMCHIP TECHNOLOGY CO LTD | |
| Package Description | DFN1006, 3 PIN | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2020-03-10 | |
| Samacsys Manufacturer | Comchip Technology | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 60 V | |
| Drain Current-Max (ID) | 0.3 A | |
| Drain-source On Resistance-Max | 0.0025 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| Feedback Cap-Max (Crss) | 4 pF | |
| JESD-30 Code | R-PBCC-N3 | |
| JESD-609 Code | e3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation Ambient-Max | 0.15 W | |
| Power Dissipation-Max (Abs) | 0.15 W | |
| Reference Standard | AEC-Q101 | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Position | BOTTOM | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
A2N7002HL-HF Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring a solid ground plane on the top and bottom layers of the PCB.
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To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions, use a heat sink if necessary, and ensure good airflow around the device. Additionally, the device should be derated according to the temperature derating curve provided in the datasheet.
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The maximum allowable voltage on the gate pin is ±20V, but it is recommended to keep the gate voltage between -5V and +15V to ensure reliable operation and prevent damage to the device.
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Yes, the A2N7002HL-HF is suitable for switching applications due to its low RDS(on) and high current capability. However, it is essential to follow the recommended switching frequency and ensure that the device is properly driven to prevent overheating and damage.
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To protect the device from ESD, it is recommended to follow proper handling and storage procedures, use ESD-safe equipment and materials, and ensure that the device is properly grounded during assembly and testing.