Part Details for A2F500M3G-1FG256I by Microchip Technology Inc
Results Overview of A2F500M3G-1FG256I by Microchip Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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A2F500M3G-1FG256I Information
A2F500M3G-1FG256I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A2F500M3G-1FG256I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1100-A2F500M3G-1FG256I-ND
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DigiKey | IC SOC CORTEX-M3 100MHZ 256FBGA Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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Onlinecomponents.com | RoHS: Compliant | 5 Factory Stock |
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$0 | Buy Now |
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NAC | A2F500M3G-1FG256I RoHS: Compliant Min Qty: 90 Package Multiple: 1 Container: Tray | 0 |
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RFQ | |
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DISTI #
A2F500M3G-1FG256I
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EBV Elektronik | FPGA SmartFusion Family 500K Gates 100MHz 130nm CMOS Technology 15V 256Pin FBGA (Alt: A2F500M3G-1FG256I) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for A2F500M3G-1FG256I
A2F500M3G-1FG256I CAD Models
A2F500M3G-1FG256I Part Data Attributes
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A2F500M3G-1FG256I
Microchip Technology Inc
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Datasheet
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A2F500M3G-1FG256I
Microchip Technology Inc
Field Programmable Gate Array, 11520 CLBs, 500000 Gates, 100MHz, 11520-Cell, CMOS, PBGA256
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 12 Weeks | |
| JESD-30 Code | S-PBGA-B256 | |
| Length | 17 mm | |
| Number of Equivalent Gates | 500000 | |
| Number of Inputs | 117 | |
| Number of Logic Cells | 11520 | |
| Number of Outputs | 117 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 500000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Programmable Logic Type | FPGA SOC | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm |
A2F500M3G-1FG256I Frequently Asked Questions (FAQ)
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The recommended operating temperature range for the A2F500M3G-1FG256I is -40°C to 100°C.
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To implement a secure boot mechanism, use the device's built-in secure boot features, such as the Boot Flash Memory (BFM) and the Secure Boot ROM (SBR). These features allow you to store a secure boot loader in the BFM and use the SBR to authenticate the boot loader.
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The maximum frequency at which you can clock the A2F500M3G-1FG256I is 500 MHz.
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To configure the A2F500M3G-1FG256I for low power consumption, use the device's power management features, such as the Power Management Controller (PMC) and the Dynamic Voltage and Frequency Scaling (DVFS) feature. These features allow you to dynamically adjust the device's voltage and frequency to minimize power consumption.
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No, the A2F500M3G-1FG256I is not a radiation-hardened device and is not suitable for use in radiation-hardened applications.