Part Details for A2F500M3G-1CS288I by Microchip Technology Inc
Results Overview of A2F500M3G-1CS288I by Microchip Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
A2F500M3G-1CS288I Information
A2F500M3G-1CS288I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A2F500M3G-1CS288I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
A2F500M3G-1CS288I-ND
|
DigiKey | IC SOC CORTEX-M3 100MHZ 288CSP Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
|
DISTI #
A2F500M3G-1CS288I
|
Avnet Americas | FPGA SmartFusion 500K Gates 6000 Cells 100MHz 130nm (CMOS) Technology 1.5V 288-Pin CSP - Trays (Alt: A2F500M3G-1CS288I) RoHS: Not Compliant Min Qty: 176 Package Multiple: 176 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
|
NAC | A2F500M3G-1CS288I RoHS: Compliant Min Qty: 176 Package Multiple: 1 Container: Tray | 0 |
|
RFQ | |
|
DISTI #
A2F500M3G-1CS288I
|
EBV Elektronik | FPGA SmartFusion 500K Gates 6000 Cells 100MHz 130nm CMOS Technology 15V 288Pin CSP (Alt: A2F500M3G-1CS288I) RoHS: Not Compliant Min Qty: 176 Package Multiple: 176 Lead time: 13 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for A2F500M3G-1CS288I
A2F500M3G-1CS288I CAD Models
A2F500M3G-1CS288I Part Data Attributes
|
|
A2F500M3G-1CS288I
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
A2F500M3G-1CS288I
Microchip Technology Inc
Field Programmable Gate Array, 11520 CLBs, 500000 Gates, 100MHz, 11520-Cell, CMOS, PBGA288
|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 12 Weeks | |
| JESD-30 Code | S-PBGA-B288 | |
| Length | 11 mm | |
| Number of Equivalent Gates | 500000 | |
| Number of Inputs | 135 | |
| Number of Logic Cells | 11520 | |
| Number of Outputs | 135 | |
| Number of Terminals | 288 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 500000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA288,21X21,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Programmable Logic Type | FPGA SOC | |
| Seated Height-Max | 1.05 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm |
A2F500M3G-1CS288I Frequently Asked Questions (FAQ)
-
A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note is available on Microchip's website.
-
A POR circuit can be implemented using an external resistor and capacitor connected to the POR pin. The datasheet provides a recommended circuit diagram and component values.
-
Microchip provides a separate document outlining the device's reliability and safety features. Engineers should consult this document to ensure the device meets their specific requirements.
-
The device is not radiation-hardened, but it can operate in high-temperature environments up to 125°C. However, engineers should consult the datasheet for specific temperature and voltage derating guidelines.
-
The datasheet provides power consumption estimates, but engineers can further optimize power consumption by using the device's power-saving modes, reducing clock frequencies, and minimizing I/O activity.