Part Details for A2F200M3F-FG256I by Microsemi Corporation
Results Overview of A2F200M3F-FG256I by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
A2F200M3F-FG256I Information
A2F200M3F-FG256I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A2F200M3F-FG256I
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Vyrian | Programmable ICs | 127 |
|
RFQ |
Part Details for A2F200M3F-FG256I
A2F200M3F-FG256I CAD Models
A2F200M3F-FG256I Part Data Attributes
|
A2F200M3F-FG256I
Microsemi Corporation
Buy Now
Datasheet
|
Compare Parts:
A2F200M3F-FG256I
Microsemi Corporation
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | FPBGA-256 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Equivalent Gates | 200000 | |
Number of Inputs | 117 | |
Number of Logic Cells | 4608 | |
Number of Outputs | 117 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 200000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Programmable Logic Type | FPGA SOC | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm |
Alternate Parts for A2F200M3F-FG256I
This table gives cross-reference parts and alternative options found for A2F200M3F-FG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A2F200M3F-FG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
A2F200M3F-FGH256Y | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, HALOGEN FREE, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGH256Y |
A2F200M3F-FGG256I | Actel Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256, 1 MM PITCH, GREEN, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGG256I |
A2F200M3F-FGG256Y | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGG256Y |
A2F200M3F-FG256Y | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FG256Y |
A2F200M3F-FG256YI | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FG256YI |
A2F200M3F-FGH256I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, HALOGEN FREE, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGH256I |
A2F200M3F-FGH256 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, HALOGEN FREE, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGH256 |
A2F200M3F-FGG256YI | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGG256YI |
A2F200M3F-FGH256YI | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, HALOGEN FREE, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGH256YI |
A2F200M3F-FGG256 | Actel Corporation | Check for Price | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256, 1 MM PITCH, GREEN, FBGA-256 | A2F200M3F-FG256I vs A2F200M3F-FGG256 |
A2F200M3F-FG256I Frequently Asked Questions (FAQ)
-
Microsemi provides a PCB design guide and layout recommendations in their documentation, including the 'A2F200M3F-FG256I PCB Design Guide' and 'PCB Layout and Routing Guidelines' application notes. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet thermal requirements.
-
Microsemi recommends using a multi-layer PCB with a dedicated power plane and following their power supply design guidelines, including the use of decoupling capacitors, voltage regulators, and power filtering. Additionally, consider using a power management IC (PMIC) specifically designed for FPGAs, such as the Microsemi Power Manager (MPM).
-
The A2F200M3F-FG256I has a maximum junction temperature of 100°C. To ensure reliable operation, implement a thermal management strategy that includes a heat sink, thermal interface material, and airflow management. Microsemi provides thermal design guidelines and recommends using their Thermal Design Calculator tool to estimate the FPGA's thermal performance.
-
The A2F200M3F-FG256I has a built-in clock management unit (CMU) that allows for clock generation, distribution, and management. Microsemi provides documentation on how to configure and use the CMU, including the 'A2F200M3F-FG256I Clock Management User Guide' and 'Libero SoC Design Suite' software.
-
The A2F200M3F-FG256I has built-in security features, including a secure boot mechanism, encryption, and authentication. Microsemi provides documentation on how to implement secure boot and encryption, including the 'A2F200M3F-FG256I Security User Guide' and 'Libero SoC Design Suite' software. Additionally, consider using Microsemi's Secure Boot and Encryption IP cores.