Datasheets
A2F200M3F-1CSG288I by:

Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA288

Part Details for A2F200M3F-1CSG288I by Microchip Technology Inc

Results Overview of A2F200M3F-1CSG288I by Microchip Technology Inc

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Financial Technology (Fintech) Computing and Data Storage Smart Cities Aerospace and Defense Telecommunications Communication and Networking Automotive

A2F200M3F-1CSG288I Information

A2F200M3F-1CSG288I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for A2F200M3F-1CSG288I

Part # Distributor Description Stock Price Buy
Onlinecomponents.com   RoHS: Compliant 517 Factory Stock
  • 0 $0
$0 Buy Now
NAC A2F200M3F-1CSG288I RoHS: Compliant Min Qty: 176 Package Multiple: 1 Container: Box 0
RFQ
DISTI # A2F200M3F-1CSG288I
EBV Elektronik FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm CMOS Technology 15V 288Pin CSP (Alt: A2F200M3F-1CSG288I) RoHS: Not Compliant Min Qty: 176 Package Multiple: 176 Lead time: 13 Weeks, 0 Days EBV - 0
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Part Details for A2F200M3F-1CSG288I

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A2F200M3F-1CSG288I Part Data Attributes

A2F200M3F-1CSG288I Microchip Technology Inc
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A2F200M3F-1CSG288I Microchip Technology Inc Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA288
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks
JESD-30 Code S-PBGA-B288
Length 11 mm
Number of Equivalent Gates 200000
Number of Inputs 135
Number of Logic Cells 4608
Number of Outputs 135
Number of Terminals 288
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 200000 GATES
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA288,21X21,20
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Programmable Logic Type FPGA SOC
Seated Height-Max 1.05 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Width 11 mm

A2F200M3F-1CSG288I Related Parts

A2F200M3F-1CSG288I Frequently Asked Questions (FAQ)

  • Microchip provides a reference design and layout guidelines in the A2F200M3F-1CSG288I datasheet and application notes. Additionally, it's recommended to follow general PCB design best practices for high-frequency and high-power devices, such as using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat.

  • To minimize power consumption and heat generation, ensure that the device is operated within the recommended voltage and frequency ranges. Implement power-saving features like dynamic voltage and frequency scaling, and consider using a thermal management system like a heat sink or fan. Additionally, optimize the system's firmware and software to reduce processing loads and minimize idle time.

  • The A2F200M3F-1CSG288I requires a stable input power supply with a voltage range of 1.2V to 1.35V. Ensure a stable voltage by using a high-quality voltage regulator, decoupling capacitors, and a low-ESR capacitor. It's also recommended to follow the power supply design guidelines provided in the datasheet and application notes.

  • The A2F200M3F-1CSG288I has multiple clock domains and timing configurations. Implement and optimize clocking and timing configurations by following the guidelines in the datasheet and application notes. Use the device's clock management unit to generate and distribute clocks, and ensure that the clock frequencies and phases are properly configured for the specific application.

  • For debugging and troubleshooting, use the device's built-in debug features, such as the Debug Access Port (DAP) and the Microchip Advanced Debug Interface (ADI). Utilize debugging tools like the Microchip MPLAB X IDE and the IAR Embedded Workbench. Additionally, follow a structured debugging approach, starting with simple tests and gradually increasing complexity to isolate and identify issues.

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