Part Details for XCZU3CG-1SBVA484E by AMD
Results Overview of XCZU3CG-1SBVA484E by AMD
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCZU3CG-1SBVA484E Information
XCZU3CG-1SBVA484E by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU3CG-1SBVA484E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
32AC9739
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Newark | Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-484, Product Range:Zynq Family Ultrascale+ Cg Series Microprocessors, Cpu Speed:1.3Ghz, Core Architecture:Arm Cortex-A53, Mpu Case Style:Fcbga, No. Of Pins:484Pins, Msl:-, Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd XCZU3CG-1SBVA484E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$445.8500 | Buy Now |
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DISTI #
122-2256-ND
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DigiKey | IC SOC CORTEX-A53 484FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$445.9000 | Buy Now |
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DISTI #
XCZU3CG-1SBVA484E
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Avnet Americas | FPGA Zynq UltraScale+ Family 154350 Cells 20nm Technology 0.85V 484-Pin FCBGA Tray - Trays (Alt: XCZU3CG-1SBVA484E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$408.1700 | Buy Now |
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DISTI #
217-CZU3CG-1SBVA484E
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Mouser Electronics | SoC FPGA XCZU3CG-1SBVA484E RoHS: Compliant | 3 |
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$445.9000 | Buy Now |
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DISTI #
XCZU3CG-1SBVA484E
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Avnet Silica | FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 085V 484Pin FCBGA Tray (Alt: XCZU3CG-1SBVA484E) RoHS: Compliant Min Qty: 1 Package Multiple: 84 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XCZU3CG-1SBVA484E
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EBV Elektronik | FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 085V 484Pin FCBGA Tray (Alt: XCZU3CG-1SBVA484E) RoHS: Compliant Min Qty: 2 Package Multiple: 84 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XCZU3CG-1SBVA484E
XCZU3CG-1SBVA484E CAD Models
XCZU3CG-1SBVA484E Part Data Attributes
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XCZU3CG-1SBVA484E
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU3CG-1SBVA484E
AMD
Microprocessor Circuit, CMOS, PBGA484, FCBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-484 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | R-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU3CG-1SBVA484E Frequently Asked Questions (FAQ)
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AMD provides a PCB design guide and layout recommendations in the UG583 document, which includes guidelines for signal integrity, power distribution, and thermal management.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption based on design parameters. Additionally, implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
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The XCZU3CG-1SBVA484E has a maximum junction temperature of 100°C. Ensure proper thermal management by using a heat sink, thermal interface material, and following the thermal design guidelines in the UG583 document.
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Implement security measures such as bitstream encryption, secure boot, and authentication using the AMD Secure Boot and Authentication (SBA) feature. Additionally, use secure protocols for communication and data transfer.
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AMD provides the Vivado Design Suite, which includes tools for design entry, synthesis, implementation, and verification. Additionally, the Xilinx Software Development Kit (SDK) provides a comprehensive development environment for software development.