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Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCZU19EG-2FFVD1760I by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCZU19EG-2FFVD1760I-ND
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DigiKey | IC SOC CORTEX-A53 1760FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$11,426.2500 | Buy Now |
DISTI #
XCZU19EG-2FFVD1760I
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Avnet Americas | FPGA Zynq UltraScale+ Family 1143450 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray - Trays (Alt: XCZU19EG-2FFVD1760I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$11,017.3080 | Buy Now |
DISTI #
217-U19EG-2FFVD1760I
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Mouser Electronics | SoC FPGA XCZU19EG-2FFVD1760I RoHS: Compliant | 0 |
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$11,242.1500 | Order Now |
DISTI #
XCZU19EG-2FFVD1760I
|
Avnet Silica | FPGA Zynq UltraScale Family 1143450 Cells 20nm Technology 085V 1760Pin FCBGA Tray (Alt: XCZU19EG-2FFVD1760I) RoHS: Compliant Min Qty: 1 Package Multiple: 12 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
XCZU19EG-2FFVD1760I
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EBV Elektronik | FPGA Zynq UltraScale Family 1143450 Cells 20nm Technology 085V 1760Pin FCBGA Tray (Alt: XCZU19EG-2FFVD1760I) RoHS: Compliant Min Qty: 1 Package Multiple: 12 Lead time: 18 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
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XCZU19EG-2FFVD1760I
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU19EG-2FFVD1760I
AMD
Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | FCBGA-1760 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 1760 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
The maximum power consumption of the XCZU19EG-2FFVD1760I is approximately 25W, but it can vary depending on the specific application, clock frequency, and usage of resources.
To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components, reduce clock frequencies, use power-gating, and implement dynamic voltage and frequency scaling (DVFS).
The maximum operating temperature of the XCZU19EG-2FFVD1760I is 100°C (industrial grade) or 125°C (extended temperature range).
To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, add termination resistors, and use differential signaling where possible. Additionally, follow the PCB design guidelines provided by AMD.
The maximum bandwidth of the XCZU19EG-2FFVD1760I's PCIe interface is 32 GT/s (gigatransfers per second) for PCIe Gen 4, which translates to approximately 32 GB/s of bandwidth.