Datasheets
XCZU19EG-2FFVD1760I by:

Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760

Part Details for XCZU19EG-2FFVD1760I by AMD

Results Overview of XCZU19EG-2FFVD1760I by AMD

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XCZU19EG-2FFVD1760I Information

XCZU19EG-2FFVD1760I by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for XCZU19EG-2FFVD1760I

Part # Distributor Description Stock Price Buy
DISTI # XCZU19EG-2FFVD1760I-ND
DigiKey IC SOC CORTEX-A53 1760FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $11,426.2500
$11,426.2500 Buy Now
DISTI # XCZU19EG-2FFVD1760I
Avnet Americas FPGA Zynq UltraScale+ Family 1143450 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray - Trays (Alt: XCZU19EG-2FFVD1760I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray 0
  • 1 $11,017.3080
$11,017.3080 Buy Now
DISTI # 217-U19EG-2FFVD1760I
Mouser Electronics SoC FPGA XCZU19EG-2FFVD1760I RoHS: Compliant 0
  • 1 $11,242.1500
$11,242.1500 Order Now
DISTI # XCZU19EG-2FFVD1760I
Avnet Silica FPGA Zynq UltraScale Family 1143450 Cells 20nm Technology 085V 1760Pin FCBGA Tray (Alt: XCZU19EG-2FFVD1760I) RoHS: Compliant Min Qty: 1 Package Multiple: 12 Lead time: 17 Weeks, 0 Days Silica - 0
Buy Now
DISTI # XCZU19EG-2FFVD1760I
EBV Elektronik FPGA Zynq UltraScale Family 1143450 Cells 20nm Technology 085V 1760Pin FCBGA Tray (Alt: XCZU19EG-2FFVD1760I) RoHS: Compliant Min Qty: 1 Package Multiple: 12 Lead time: 18 Weeks, 0 Days EBV - 0
Buy Now

Part Details for XCZU19EG-2FFVD1760I

XCZU19EG-2FFVD1760I CAD Models

XCZU19EG-2FFVD1760I Part Data Attributes

XCZU19EG-2FFVD1760I AMD
Buy Now Datasheet
Compare Parts:
XCZU19EG-2FFVD1760I AMD Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1760
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
Samacsys Manufacturer AMD
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Number of Terminals 1760
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVD1760I Related Parts

XCZU19EG-2FFVD1760I Frequently Asked Questions (FAQ)

  • The maximum power consumption of the XCZU19EG-2FFVD1760I is approximately 25W, but it can vary depending on the specific application, clock frequency, and usage of resources.

  • To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components, reduce clock frequencies, use power-gating, and implement dynamic voltage and frequency scaling (DVFS).

  • The maximum operating temperature of the XCZU19EG-2FFVD1760I is 100°C (industrial grade) or 125°C (extended temperature range).

  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, add termination resistors, and use differential signaling where possible. Additionally, follow the PCB design guidelines provided by AMD.

  • The maximum bandwidth of the XCZU19EG-2FFVD1760I's PCIe interface is 32 GT/s (gigatransfers per second) for PCIe Gen 4, which translates to approximately 32 GB/s of bandwidth.

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