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Part Details for XCZU19EG-2FFVC1760E by AMD
Results Overview of XCZU19EG-2FFVC1760E by AMD
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCZU19EG-2FFVC1760E Information
XCZU19EG-2FFVC1760E by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU19EG-2FFVC1760E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCZU19EG-2FFVC1760E-ND
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DigiKey | IC SOC CORTEX-A53 1760FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
1 In Stock |
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$9,021.2500 | Buy Now |
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DISTI #
XCZU19EG-2FFVC1760E
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Avnet Americas | XLXXCZU19EG-2FFVC1760E ZYNQ ULTRASCALE - Trays (Alt: XCZU19EG-2FFVC1760E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$8,698.3830 | Buy Now |
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DISTI #
217-U19EG-2FFVC1760E
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Mouser Electronics | SoC FPGA XCZU19EG-2FFVC1760E RoHS: Compliant | 0 |
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$8,875.9000 | Order Now |
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DISTI #
XCZU19EG-2FFVC1760E
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Avnet Silica | XLXXCZU19EG2FFVC1760E ZYNQ ULTRASCALE (Alt: XCZU19EG-2FFVC1760E) RoHS: Compliant Min Qty: 1 Package Multiple: 12 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XCZU19EG-2FFVC1760E
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EBV Elektronik | XLXXCZU19EG2FFVC1760E ZYNQ ULTRASCALE (Alt: XCZU19EG-2FFVC1760E) RoHS: Compliant Min Qty: 1 Package Multiple: 12 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Win Source Electronics | IC SOC CORTEX-A53 1760FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5) | 172 |
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$1,262.1309 | Buy Now |
Part Details for XCZU19EG-2FFVC1760E
XCZU19EG-2FFVC1760E CAD Models
XCZU19EG-2FFVC1760E Part Data Attributes
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XCZU19EG-2FFVC1760E
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU19EG-2FFVC1760E
AMD
Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | S-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Length | 42.5 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1760 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 3.71 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU19EG-2FFVC1760E Frequently Asked Questions (FAQ)
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The recommended PCB layout and stackup for the XCZU19EG-2FFVC1760E can be found in the Xilinx PCB Design Guide (UG583) and the Zynq UltraScale+ FPGA PCB Design and Pin Planning Guide (UG583). These guides provide detailed information on PCB layout, layer stackup, and signal routing to ensure optimal signal integrity.
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To optimize power consumption and thermal management, refer to the Xilinx Power Estimation and Optimization Guide (UG786) and the Zynq UltraScale+ FPGA Power Management Guide (UG584). These guides provide guidance on power estimation, optimization techniques, and thermal management strategies for the XCZU19EG-2FFVC1760E.
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The recommended clocking and reset strategies for the XCZU19EG-2FFVC1760E can be found in the Xilinx Clocking Wizard Guide (UG472) and the Zynq UltraScale+ FPGA Clocking and Reset Guide (UG585). These guides provide detailed information on clocking architectures, clock domain crossing, and reset strategies to ensure reliable and efficient system operation.
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To ensure signal integrity and reduce EMI, refer to the Xilinx Signal Integrity Guide (UG582) and the Zynq UltraScale+ FPGA PCB Design and Pin Planning Guide (UG583). These guides provide guidance on signal integrity, EMI reduction, and PCB design best practices for the XCZU19EG-2FFVC1760E.
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The recommended design flows and tools for developing and verifying designs for the XCZU19EG-2FFVC1760E can be found in the Xilinx Vivado Design Suite User Guide (UG912) and the Zynq UltraScale+ FPGA Development Guide (UG586). These guides provide detailed information on design flows, tool usage, and verification strategies for the XCZU19EG-2FFVC1760E.