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Part Details for XC7S25-2FTGB196I by AMD
Results Overview of XC7S25-2FTGB196I by AMD
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC7S25-2FTGB196I Information
XC7S25-2FTGB196I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC7S25-2FTGB196I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
67AC8664
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Newark | Fpga, 23360 Logic Cells, Fcbga-196, Fpga Type:-, No. Of Logic Cells:23360Logic Cells, Ic Case/Package:Fcbga, No. Of Pins:196Pins, Speed Grade:2, No.of User I/Os:100I/O S, Process Technology:28Nm (Hkmg), Ic Mounting:Surface Mount Rohs Compliant: Yes |Amd XC7S25-2FTGB196I RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$42.3100 | Buy Now |
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DISTI #
122-2120-ND
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DigiKey | IC FPGA 100 I/O 196CSBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
371 In Stock |
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$42.3100 | Buy Now |
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DISTI #
XC7S25-2FTGB196I
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Avnet Americas | - Trays (Alt: XC7S25-2FTGB196I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$41.4638 | Buy Now |
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DISTI #
217-XC7S25-2FTGB196I
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Mouser Electronics | FPGA - Field Programmable Gate Array XC7S25-2FTGB196I RoHS: Compliant | 85 |
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$47.3800 | Buy Now |
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DISTI #
XC7S25-2FTGB196I
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Avnet Silica | (Alt: XC7S25-2FTGB196I) RoHS: Compliant Min Qty: 1 Package Multiple: 126 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XC7S25-2FTGB196I
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EBV Elektronik | (Alt: XC7S25-2FTGB196I) RoHS: Compliant Min Qty: 15 Package Multiple: 126 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Win Source Electronics | FPGA Spartan-7 25 FTGB196 Ind | 1360 |
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$63.4437 / $95.1655 | Buy Now |
Part Details for XC7S25-2FTGB196I
XC7S25-2FTGB196I CAD Models
XC7S25-2FTGB196I Part Data Attributes
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XC7S25-2FTGB196I
AMD
Buy Now
Datasheet
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Compare Parts:
XC7S25-2FTGB196I
AMD
Field Programmable Gate Array, 1286MHz, 23360-Cell, PBGA196, CSBGA-196
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | CSBGA-196 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 1286 MHz | |
| Combinatorial Delay of a CLB-Max | 1.05 ns | |
| JESD-30 Code | S-PBGA-B196 | |
| JESD-609 Code | e3 | |
| Length | 15 mm | |
| Number of CLBs | 1825 | |
| Number of Inputs | 150 | |
| Number of Logic Cells | 23360 | |
| Number of Outputs | 150 | |
| Number of Terminals | 196 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1825 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA196,14X14,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for XC7S25-2FTGB196I
This table gives cross-reference parts and alternative options found for XC7S25-2FTGB196I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC7S25-2FTGB196I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC7S25-2CSGA324C | AMD | $43.0793 | Field Programmable Gate Array, 1286MHz, 23360-Cell, PBGA324, CSBGA-324 | XC7S25-2FTGB196I vs XC7S25-2CSGA324C |
| XC7S25-2CSGA225C | AMD | $48.5328 | Field Programmable Gate Array, 1286MHz, 23360-Cell, PBGA225, CSBGA-225 | XC7S25-2FTGB196I vs XC7S25-2CSGA225C |
| XC7S25-2CSGA225I | AMD | $56.1574 | Field Programmable Gate Array, 1286MHz, 23360-Cell, PBGA225, CSBGA-225 | XC7S25-2FTGB196I vs XC7S25-2CSGA225I |
| XC7S25-2CSGA324I | AMD | $56.1574 | Field Programmable Gate Array, 1286MHz, 23360-Cell, PBGA324, CSBGA-324 | XC7S25-2FTGB196I vs XC7S25-2CSGA324I |
| XC7S25-2TQGA144I | AMD | Check for Price | Field Programmable Gate Array, PBGA144, TQGA-144 | XC7S25-2FTGB196I vs XC7S25-2TQGA144I |
| XC7S25-2TQGA144C | AMD | Check for Price | Field Programmable Gate Array, PBGA144, TQGA-144 | XC7S25-2FTGB196I vs XC7S25-2TQGA144C |
XC7S25-2FTGB196I Frequently Asked Questions (FAQ)
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The maximum operating temperature range for XC7S25-2FTGB196I is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended grade).
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You can implement a reliable POR by using an external POR circuit or by using the internal POR circuitry of the FPGA. The internal POR circuitry is enabled by default, but it can be disabled by programming the FPGA. It's recommended to use an external POR circuit for more reliable operation.
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The recommended clocking scheme for XC7S25-2FTGB196I is to use a single clock domain for the entire design. However, if multiple clock domains are required, it's recommended to use a clock domain crossing (CDC) circuit to ensure reliable data transfer between domains.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling can be used to reduce power consumption.
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The maximum current draw for XC7S25-2FTGB196I is approximately 1.5A for the 1V core voltage and 0.5A for the 3.3V auxiliary voltage. However, the actual current draw will depend on the specific design and operating conditions.