Part Details for XC6SLX150T-2FGG900I by AMD Xilinx
Results Overview of XC6SLX150T-2FGG900I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
XC6SLX150T-2FGG900I Information
XC6SLX150T-2FGG900I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX150T-2FGG900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC FPGA 540 I/O 900FBGA | 1250 |
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$166.8340 / $192.5004 | Buy Now |
Part Details for XC6SLX150T-2FGG900I
XC6SLX150T-2FGG900I CAD Models
XC6SLX150T-2FGG900I Part Data Attributes
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XC6SLX150T-2FGG900I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC6SLX150T-2FGG900I
AMD Xilinx
Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, LEAD FREE, BGA-900
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, LEAD FREE, BGA-900 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 667 MHz | |
| Combinatorial Delay of a CLB-Max | 0.26 ns | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 11519 | |
| Number of Inputs | 530 | |
| Number of Logic Cells | 147443 | |
| Number of Outputs | 530 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 11519 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 31 mm |
Alternate Parts for XC6SLX150T-2FGG900I
This table gives cross-reference parts and alternative options found for XC6SLX150T-2FGG900I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX150T-2FGG900I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC6SLX150T-2FGG900C | AMD | Check for Price | Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, LEAD FREE, BGA-900 | XC6SLX150T-2FGG900I vs XC6SLX150T-2FGG900C |
XC6SLX150T-2FGG900I Frequently Asked Questions (FAQ)
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The maximum power consumption of the XC6SLX150T-2FGG900I is approximately 12W, but this can vary depending on the specific application and usage.
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To implement a reliable clocking scheme, use the FPGA's built-in clocking resources, such as the Digital Clock Manager (DCM) and the Phase-Locked Loop (PLL) blocks. These resources allow you to generate and distribute clock signals with low jitter and skew.
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To optimize your design for area and speed, use the Xilinx Vivado Design Suite's built-in optimization tools, such as the 'Optimize for Area' and 'Optimize for Speed' options. Additionally, consider using pipelining, parallel processing, and other design techniques to improve performance.
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To ensure that your design is secure and resistant to tampering, use the FPGA's built-in security features, such as the AES encryption engine and the Secure Boot mechanism. Additionally, consider using secure protocols and encryption algorithms to protect your design.
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The maximum operating temperature range for the XC6SLX150T-2FGG900I is -40°C to 100°C, but this can vary depending on the specific application and usage.