Part Details for TZ425N16KOF by Infineon Technologies AG
Results Overview of TZ425N16KOF by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
TZ425N16KOF Information
TZ425N16KOF by Infineon Technologies AG is an Other Trigger Device.
Other Trigger Devices are under the broader part category of Trigger Devices.
Trigger devices initiate or control actions in electronic circuits by producing output signals when specific input conditions are met. They are commonly used in timing circuits and pulse generators. Read more about Trigger Devices on our Trigger Devices part category page.
Price & Stock for TZ425N16KOF
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
641-TZ425N16KOF
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Mouser Electronics | Thyristor Modules 1600V 800A SINGLE RoHS: Compliant | 0 |
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$164.9500 / $179.3500 | Order Now |
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DISTI #
TZ425N16KOF
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TME | Module: thyristor, single thyristor, 1.6kV, 425A, BG-PB501-1 Min Qty: 1 | 0 |
|
$193.9000 / $275.9700 | RFQ |
Part Details for TZ425N16KOF
TZ425N16KOF CAD Models
TZ425N16KOF Part Data Attributes
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TZ425N16KOF
Infineon Technologies AG
Buy Now
Datasheet
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TZ425N16KOF
Infineon Technologies AG
Trigger Device
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | MODULE | |
| Package Description | MODULE-4 | |
| Pin Count | 4 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.30.00.80 | |
| Samacsys Manufacturer | Infineon | |
| Case Connection | ISOLATED | |
| Circuit Commutated Turn-off Time-Nom | 250 µs | |
| Configuration | SINGLE | |
| Critical Rate of Rise of Off-State Voltage-Min | 1000 V/us | |
| DC Gate Trigger Current-Max | 250 mA | |
| DC Gate Trigger Voltage-Max | 1.5 V | |
| Desc. of Quick-Connects | G-GR | |
| Desc. of Screw Terminals | A-K | |
| Holding Current-Max | 300 mA | |
| JESD-30 Code | R-XUFM-X4 | |
| Leakage Current-Max | 80 mA | |
| Non-Repetitive Pk On-state Cur | 14500 A | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| On-State Voltage-Max | 1.5 V | |
| On-state Current-Max | 510000 A | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| RMS On-state Current-Max | 800 A | |
| Reference Standard | IEC-747-6, UL RECOGNIZED | |
| Repetitive Peak Off-state Leakage Current-Max | 80000 µA | |
| Repetitive Peak Off-state Voltage | 1600 V | |
| Repetitive Peak Reverse Voltage | 1600 V | |
| Surface Mount | NO | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UPPER | |
| Trigger Device Type | SCR |
TZ425N16KOF Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance.
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To ensure reliable operation in high-temperature environments, it's essential to follow Infineon's guidelines for thermal management, including proper heat sink design, thermal interface material selection, and monitoring of junction temperature (Tj).
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Infineon recommends using a gate drive circuit with a high current capability (e.g., 2A to 5A) and a low output impedance to ensure fast switching times and minimize ringing. A dedicated gate driver IC, such as the Infineon 1EDC or 2EDC family, can be used.
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To protect the device from overvoltage and overcurrent conditions, it's recommended to use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) circuit. Infineon provides guidelines for OVP and OCP circuit design in their application notes.
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To prevent damage, it's essential to follow proper storage and handling procedures, including storing the devices in their original packaging, avoiding exposure to moisture, and handling the devices by the body or leads to prevent electrostatic discharge (ESD).