Part Details for TS1854AIDT by STMicroelectronics
Results Overview of TS1854AIDT by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
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TS1854AIDT Information
TS1854AIDT by STMicroelectronics is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Part Details for TS1854AIDT
TS1854AIDT CAD Models
TS1854AIDT Part Data Attributes
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TS1854AIDT
STMicroelectronics
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Datasheet
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TS1854AIDT
STMicroelectronics
QUAD OP-AMP, 1000uV OFFSET-MAX, 0.6MHz BAND WIDTH, PDSO14, ROHS COMPLIANT, SO-14
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | SOIC | |
| Package Description | ROHS COMPLIANT, SO-14 | |
| Pin Count | 14 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 0.055 µA | |
| Bias Current-Max (IIB) @25C | 0.063 µA | |
| Common-mode Reject Ratio-Nom | 90 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 1000 µV | |
| JESD-30 Code | R-PDSO-G14 | |
| JESD-609 Code | e4 | |
| Length | 8.65 mm | |
| Low-Bias | NO | |
| Low-Offset | NO | |
| Micropower | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 4 | |
| Number of Terminals | 14 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP14,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Packing Method | TAPE AND REEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Slew Rate-Nom | 0.2 V/us | |
| Supply Current-Max | 0.22 mA | |
| Supply Voltage Limit-Max | 7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Unity Gain BW-Nom | 600 | |
| Wideband | NO | |
| Width | 3.9 mm |
Alternate Parts for TS1854AIDT
This table gives cross-reference parts and alternative options found for TS1854AIDT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TS1854AIDT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TS1854AID | STMicroelectronics | Check for Price | QUAD OP-AMP, 1000uV OFFSET-MAX, 0.6MHz BAND WIDTH, PDSO14, ROHS COMPLIANT, SO-14 | TS1854AIDT vs TS1854AID |
TS1854AIDT Frequently Asked Questions (FAQ)
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STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure proper thermal design, use a heat sink if necessary, and consider derating the device's power dissipation at high temperatures.
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STMicroelectronics recommends using a low-ESR ceramic capacitor with a value between 1uF to 10uF, depending on the specific application requirements. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
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The enable pin (EN) should be tied to a logic high during normal operation. During power-up, the EN pin should be held low until the input voltage (VIN) reaches the minimum operating voltage. During power-down, the EN pin should be held low to ensure a clean shutdown.
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The maximum allowed voltage on the output pin (VOUT) during startup or fault conditions is 6V. Exceeding this voltage may damage the internal circuitry. Ensure that the output voltage is properly clamped or protected to prevent overvoltage conditions.