Part Details for TMS5703137BPGEQQ1 by Texas Instruments
Results Overview of TMS5703137BPGEQQ1 by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TMS5703137BPGEQQ1 Information
TMS5703137BPGEQQ1 by Texas Instruments is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TMS5703137BPGEQQ1
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 1189 |
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RFQ |
Part Details for TMS5703137BPGEQQ1
TMS5703137BPGEQQ1 CAD Models
TMS5703137BPGEQQ1 Part Data Attributes
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TMS5703137BPGEQQ1
Texas Instruments
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Datasheet
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TMS5703137BPGEQQ1
Texas Instruments
32-BIT, FLASH, 160MHz, RISC MICROCONTROLLER, PQFP144, GREEN, PLASTIC, LQFP-144
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | QFP | |
Package Description | GREEN, PLASTIC, LQFP-144 | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | YES | |
CPU Family | CORTEX-R4F | |
Clock Frequency-Max | 80 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
Format | FLOATING POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-PQFP-G144 | |
JESD-609 Code | e4 | |
Length | 20 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 16 | |
Number of I/O Lines | 58 | |
Number of Terminals | 144 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP144,.87SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 262144 | |
ROM (words) | 3145728 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.6 mm | |
Speed | 160 MHz | |
Supply Current-Max | 420 mA | |
Supply Voltage-Max | 1.32 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 20 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
TMS5703137BPGEQQ1 Frequently Asked Questions (FAQ)
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The recommended oscillator crystal frequency for the TMS5703137BPGEQQ1 is 16 MHz or 20 MHz, depending on the specific application and clock speed requirements.
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To configure the flash memory for optimal performance and endurance, it is recommended to use the Flash API provided by Texas Instruments, which includes functions for programming, erasing, and verifying the flash memory. Additionally, it is important to follow the guidelines for flash memory usage and wear leveling to ensure optimal performance and endurance.
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The power consumption characteristics of the TMS5703137BPGEQQ1 vary depending on the operating frequency, voltage, and mode of operation. According to the datasheet, the typical power consumption is around 250 mA at 1.2 V and 200 MHz, but this can be reduced to around 10 mA in low-power mode. It is recommended to consult the datasheet and application notes for more detailed information on power consumption and power management.
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The TMS5703137BPGEQQ1 has built-in features to support functional safety and security, such as error correction code (ECC) for flash and RAM, and a hardware security module (HSM) for secure boot and encryption. To implement functional safety and security features, it is recommended to follow the guidelines and recommendations provided by Texas Instruments in the datasheet and application notes, and to consult with safety and security experts to ensure compliance with relevant standards and regulations.
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The TMS5703137BPGEQQ1 has a maximum junction temperature of 150°C, and it is recommended to ensure that the device is operated within the specified temperature range to prevent overheating and ensure reliable operation. Thermal management considerations include providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.