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Part Details for TMPN3150B1AF by Toshiba America Electronic Components
Results Overview of TMPN3150B1AF by Toshiba America Electronic Components
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
TMPN3150B1AF Information
TMPN3150B1AF by Toshiba America Electronic Components is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TMPN3150B1AF
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | Electronic Component RoHS: Not Compliant |
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RFQ | |
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Velocity Electronics | Our Stock | 10 |
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RFQ | |
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Win Source Electronics | Neuron Chip For Distributed Intelligent Control Networks (LONWORKS) | 324 |
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$166.8333 / $192.5001 | Buy Now |
Part Details for TMPN3150B1AF
TMPN3150B1AF CAD Models
TMPN3150B1AF Part Data Attributes
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TMPN3150B1AF
Toshiba America Electronic Components
Buy Now
Datasheet
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Compare Parts:
TMPN3150B1AF
Toshiba America Electronic Components
IC 5 CHANNEL(S), 1.25M bps, LOCAL AREA NETWORK CONTROLLER, PQFP64, 14 X 14 MM, 0.80 MM PITCH, QFP-64, Serial IO/Communication Controller
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | 14 X 14 MM, 0.80 MM PITCH, QFP-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Toshiba | |
| Address Bus Width | 16 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 10 MHz | |
| Communication Protocol | ASYNC, BIT | |
| Data Transfer Rate-Max | 0.15625 MBps | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQFP-G64 | |
| JESD-609 Code | e0 | |
| Length | 14 mm | |
| Low Power Mode | NO | |
| Number of Serial I/Os | 5 | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP64,.66SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.15 mm | |
| Supply Current-Max | 30 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Alternate Parts for TMPN3150B1AF
This table gives cross-reference parts and alternative options found for TMPN3150B1AF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMPN3150B1AF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TMPN3150B1AFG | Toshiba America Electronic Components | Check for Price | IC 1 CHANNEL(S), LOCAL AREA NETWORK CONTROLLER, PQFP64, 14 X 14 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-64, Serial IO/Communication Controller | TMPN3150B1AF vs TMPN3150B1AFG |
TMPN3150B1AF Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
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Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
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Handle the device by the body, not the leads, to prevent damage. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and do not touch the device's electrical contacts to prevent electrostatic discharge.
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Yes, the TMPN3150B1AF is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards or customer requirements.
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Check the device's pinout and connections for correctness. Verify that the device is operated within the recommended voltage and temperature ranges. Use a oscilloscope or logic analyzer to check the device's output signals. Consult the datasheet and application notes for troubleshooting guidelines.