Part Details for TLV2231IDBVTG4 by Texas Instruments
Results Overview of TLV2231IDBVTG4 by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
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TLV2231IDBVTG4 Information
TLV2231IDBVTG4 by Texas Instruments is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for TLV2231IDBVTG4
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Amplifiers | 55 |
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RFQ |
Part Details for TLV2231IDBVTG4
TLV2231IDBVTG4 CAD Models
TLV2231IDBVTG4 Part Data Attributes
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TLV2231IDBVTG4
Texas Instruments
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Datasheet
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TLV2231IDBVTG4
Texas Instruments
Single, 10-V, 2-MHz operational amplifier 5-SOT-23 -40 to 85
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | SOT-23 | |
| Package Description | GREEN, SOT-23, 5 PIN | |
| Pin Count | 5 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 0.00015 µA | |
| Bias Current-Max (IIB) @25C | 0.00006 µA | |
| Common-mode Reject Ratio-Min | 60 dB | |
| Common-mode Reject Ratio-Nom | 70 dB | |
| Frequency Compensation | YES | |
| Input Offset Current-Max (IIO) | 0.00006 µA | |
| Input Offset Voltage-Max | 3000 µV | |
| JESD-30 Code | R-PDSO-G5 | |
| JESD-609 Code | e4 | |
| Length | 2.9 mm | |
| Low-Bias | YES | |
| Low-Offset | NO | |
| Micropower | YES | |
| Moisture Sensitivity Level | 1 | |
| Neg Supply Voltage Limit-Max | ||
| Neg Supply Voltage-Nom (Vsup) | ||
| Number of Functions | 1 | |
| Number of Terminals | 5 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LSSOP | |
| Package Equivalence Code | TSOP5/6,.11,37 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.45 mm | |
| Slew Rate-Min | 0.5 V/us | |
| Slew Rate-Nom | 1.6 V/us | |
| Supply Current-Max | 1.3 mA | |
| Supply Voltage Limit-Max | 12 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.95 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Unity Gain BW-Nom | 2000 | |
| Voltage Gain-Min | 300 | |
| Wideband | NO | |
| Width | 1.6 mm |
Alternate Parts for TLV2231IDBVTG4
This table gives cross-reference parts and alternative options found for TLV2231IDBVTG4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TLV2231IDBVTG4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TLV2231IDBVRG4 | Texas Instruments | Check for Price | Single, 10-V, 2-MHz operational amplifier 5-SOT-23 -40 to 85 | TLV2231IDBVTG4 vs TLV2231IDBVRG4 |
| TLV2731CDBVT | Texas Instruments | Check for Price | Single, 10-V, 2-MHz operational amplifier with low offset drift (0.5 uV/C) 5-SOT-23 0 to 70 | TLV2231IDBVTG4 vs TLV2731CDBVT |
| TLV2231CDBVT | Texas Instruments | Check for Price | Single, 10-V, 2-MHz operational amplifier 5-SOT-23 0 to 70 | TLV2231IDBVTG4 vs TLV2231CDBVT |
| TLV2731IDBVT | Texas Instruments | Check for Price | Single, 10-V, 2-MHz operational amplifier with low offset drift (0.5 uV/C) 5-SOT-23 -40 to 85 | TLV2231IDBVTG4 vs TLV2731IDBVT |
| TLV2231CDBVRG4 | Texas Instruments | Check for Price | Single LinCMOS™ Rail-To-Rail uPower Operational Amplifier 5-SOT-23 0 to 70 | TLV2231IDBVTG4 vs TLV2231CDBVRG4 |
| TLV2731CDBVTG4 | Texas Instruments | Check for Price | Single LinCMOS™ Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 | TLV2231IDBVTG4 vs TLV2731CDBVTG4 |
| TLV2731CDBV | Texas Instruments | Check for Price | Single LinCMOS(TM) Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 | TLV2231IDBVTG4 vs TLV2731CDBV |
| TLV2731CDBVR | Texas Instruments | Check for Price | Single, 10-V, 2-MHz operational amplifier with low offset drift (0.5 uV/C) 5-SOT-23 0 to 70 | TLV2231IDBVTG4 vs TLV2731CDBVR |
| TLV2731IDBVTG4 | Texas Instruments | Check for Price | Single, 10-V, 2-MHz operational amplifier with low offset drift (0.5 uV/C) 5-SOT-23 | TLV2231IDBVTG4 vs TLV2731IDBVTG4 |
| TLV2731IDBVRG4 | Texas Instruments | Check for Price | Single LinCMOS(TM) Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 -40 to 85 | TLV2231IDBVTG4 vs TLV2731IDBVRG4 |
TLV2231IDBVTG4 Frequently Asked Questions (FAQ)
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Texas Instruments recommends a compact layout with the TLV2231IDBVTG4 placed close to the power supply bypass capacitors, and the input and output pins should be routed away from each other to minimize noise coupling. A 4-layer PCB with a solid ground plane is also recommended.
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The TLV2231IDBVTG4 is rated for operation from -40°C to 125°C. Ensure that the device is properly heatsinked, and the PCB is designed to dissipate heat efficiently. Also, avoid exposing the device to extreme temperatures during storage or handling.
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Texas Instruments recommends using 10nF to 100nF ceramic capacitors for input and output bypassing. The exact value depends on the specific application and noise requirements.
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The TLV2231IDBVTG4 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded.
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The maximum power dissipation for the TLV2231IDBVTG4 is 1.4W. Ensure that the device is properly heatsinked and the PCB is designed to dissipate heat efficiently to avoid overheating.